PIC16F76-I/SO Microchip Technology, PIC16F76-I/SO Datasheet - Page 162
![IC MCU FLASH 8KX14 A/D 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F76-I/SO
Manufacturer Part Number
PIC16F76-I/SO
Description
IC MCU FLASH 8KX14 A/D 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-I/SO
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Data Rom Size
368 B
Height
2.31 mm
Length
17.87 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F76-I/SO
Manufacturer:
MICROCHI
Quantity:
1 200
Company:
Part Number:
PIC16F76-I/SO
Manufacturer:
MOT
Quantity:
50
Part Number:
PIC16F76-I/SO
Manufacturer:
MIC
Quantity:
20 000
PIC16F7X
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30325B-page 160
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
c
CH2 x 45
#leads=n1
Dimension Limits
n
E2
E1
1
E
2
CH1 x 45
Units
CH1
CH2
A2
A3
D1
E2
D2
A1
E1
B1
n1
E
D
B
n
p
A
c
D1
A2
MIN
.165
.145
.020
.024
.040
.000
.685
.685
.650
.650
.590
.590
.008
.026
.013
D
0
0
INCHES*
35
NOM
.050
.173
.153
.028
.029
.045
.005
.690
.690
.653
.653
.620
.620
.029
.020
.011
44
A
11
5
5
MAX
A3
.180
.160
.035
.034
.050
.010
.695
.695
.656
.656
.630
.630
.013
.032
.021
10
10
MIN
17.40
17.40
14.99
14.99
16.51
16.51
B1
4.19
3.68
1.02
0.00
0.20
0.66
0.33
D2
B
0.51
0.61
0
0
MILLIMETERS
p
NOM
2002 Microchip Technology Inc.
17.53
17.53
16.59
16.59
15.75
15.75
1.27
4.39
3.87
0.74
1.14
0.13
0.27
0.74
0.71
0.51
44
11
5
5
A1
MAX
17.65
17.65
16.66
16.66
16.00
16.00
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.53
0.81
10
10