PIC16F76-I/SO Microchip Technology, PIC16F76-I/SO Datasheet - Page 6
![IC MCU FLASH 8KX14 A/D 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F76-I/SO
Manufacturer Part Number
PIC16F76-I/SO
Description
IC MCU FLASH 8KX14 A/D 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-I/SO
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
I2C/SPI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 8-bit
Data Rom Size
368 B
Height
2.31 mm
Length
17.87 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.49 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F76-I/SO
Manufacturer:
MICROCHI
Quantity:
1 200
Company:
Part Number:
PIC16F76-I/SO
Manufacturer:
MOT
Quantity:
50
Part Number:
PIC16F76-I/SO
Manufacturer:
MIC
Quantity:
20 000
PIC16F7X
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Universal Synchronous Asynchronous Receiver Transmitter (USART) ................................................................................... 69
11.0 Analog-to-Digital Converter (A/D) Module ................................................................................................................................ 83
12.0 Special Features of the CPU .................................................................................................................................................... 89
13.0 Instruction Set Summary......................................................................................................................................................... 105
14.0 Development Support ............................................................................................................................................................. 113
15.0 Electrical Characteristics......................................................................................................................................................... 119
16.0 DC and AC Characteristics Graphs and Tables ..................................................................................................................... 141
17.0 Packaging Information ............................................................................................................................................................ 151
Appendix A:
Appendix B:
Appendix C:
Index ................................................................................................................................................................................................. 163
On-Line Support................................................................................................................................................................................ 169
Reader Response ............................................................................................................................................................................. 170
PIC16F7X Product Identification System .......................................................................................................................................... 171
DS30325B-page 4
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Device Overview ......................................................................................................................................................................... 5
Memory Organization................................................................................................................................................................ 13
Reading Program Memory........................................................................................................................................................ 29
I/O Ports.................................................................................................................................................................................... 31
Timer0 Module .......................................................................................................................................................................... 43
Timer1 Module .......................................................................................................................................................................... 47
Timer2 Module .......................................................................................................................................................................... 51
Capture/Compare/PWM Modules ............................................................................................................................................. 53
Synchronous Serial Port (SSP) Module.................................................................................................................................... 59
http://www.microchip.com
Revision History ........................................................................................................................................................ 161
Device Differences .................................................................................................................................................... 161
Conversion Considerations ....................................................................................................................................... 162
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2002 Microchip Technology Inc.