PIC24HJ64GP506-I/PT Microchip Technology, PIC24HJ64GP506-I/PT Datasheet - Page 12
![IC PIC MCU FLASH 32KX16 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC24HJ64GP506-I/PT
Manufacturer Part Number
PIC24HJ64GP506-I/PT
Description
IC PIC MCU FLASH 32KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206-IPT.pdf
(292 pages)
3.PIC24HJ64GP206-IPT.pdf
(8 pages)
4.PIC24HJ64GP206-IPT.pdf
(20 pages)
5.PIC24HJ64GP206-IPT.pdf
(26 pages)
6.PIC24HJ256GP206-IPT.pdf
(58 pages)
Specifications of PIC24HJ64GP506-I/PT
Program Memory Type
FLASH
Program Memory Size
64KB (22K x 24)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8 KB
Interface Type
3-Wire/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Number Of Timers
13
Operating Supply Voltage
0 V to 2.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
18-ch x 12-bit
Controller Family/series
PIC24
No. Of I/o's
53
Ram Memory Size
8KB
Cpu Speed
40MIPS
No. Of Timers
13
Embedded Interface Type
CAN, I2C, SPI, UART
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC24HJ64GP506-I/PT
Manufacturer:
Microchip Technology
Quantity:
352
Company:
Part Number:
PIC24HJ64GP506-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC24HJ64GP506-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC24HJXXXGPX06/X08/X10
30. Module: SPI
31. Module: UART
DS80280G-page 12
SPI1 functionality for pin 34 (U1RX/SDI1/RF2) is
enabled by the SPI2 module. As a result, two side
effects occur:
1. RF2 functionality is disabled if the SPI2 module
2. This pin will not function as SDI1 if the SPI1
This issue affects 64-pin devices only:
• PIC24HJ64GP206
• PIC24HJ128GP206
• PIC24HJ256GP206
• PIC24HJ128GP306
• PIC24HJ64GP506
• PIC24HJ128GP506
Work around
Two conditions apply:
1. If the SPI2 module is used, pin 34 cannot be
2. If the SPI1 module is used, the SPI2 module
The auto-baud feature may miscalculate for
certain baud rate and clock speed combinations,
resulting in a BRG value that is greater than or less
than the expected value by 1. This may result in
reception or transmission failures.
Work around
Test the auto-baud rate at various clock speed and
baud rate combinations that would be used in an
application. If an inaccurate BRG value is
generated, manually correct the baud rate in user
software.
is enabled.
module is enabled.
used as an I/O (RF2). It is recommended to
use another I/O pin.
must also be enabled to gain SDI1 functionality
on pin 34. As an alternative, I/O (RF2) can be
configured as an input, which will allow pin 34
to function as SDI1.
32. Module: Device ID Register
On a few devices, the content of the Device ID
register can change from the factory programmed
default value immediately after RTSP or ICSP™
Flash programming.
As a result, development tools will not recognize
these devices and will generate an error message
indicating that the device ID and the device part
number
peripherals will be reconfigured and will not
function as described in the device data sheet.
Refer to Section 5. “Flash Programming”
(DS70191), of the “dsPIC33F Family Reference
Manual” for an explanation of RTSP and ICSP
Flash programming.
Work around
All RTSP and ICSP Flash programming routines
must be modified as follows:
1. No word programming is allowed. Any word
2. During row programming, load write latches as
3. After latches are loaded, reload any latch
4. Start
5. After row programming is complete, verify the
6. If Flash verification errors are found, repeat
Steps 1 through 5 in the work around are
implemented in MPLAB IDE version 8.00 or higher
for the MPLAB ICD 2, MPLAB REAL ICE™
in-circuit emulator and PM3 tools.
programming must be replaced with row
programming.
described in 5.4.2.3 “Loading Write Latches”
of
(DS70191).
location (in a given row) that has 5 LSB set to
0x18, with the original data. For example,
reload one of the following latch locations with
the desired data:
0xXXXX18, 0xXXXX38, 0xXXXX58,
0xXXXX78, 0xXXXX98, 0xXXXXB8,
0xXXXXD8, 0xXXXXF8
NVMOP<3:0> = ‘0001’ (memory row program
operation) in the NVMCON register.
contents of Flash memory.
steps 2 through 5. If Flash verification errors
are found after a second iteration, report this
problem to Microchip.
Section
do
row
not
© 2008 Microchip Technology Inc.
5.
programming
match.
“Flash
Additionally,
Programming”
by
setting
some