PIC24HJ128GP206-I/PT Microchip Technology, PIC24HJ128GP206-I/PT Datasheet - Page 276

• Manufacturer Part Number: PIC24HJ128GP206-I/PT
• Description: IC PIC MCU FLASH 64KX16 64TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ128GP206-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (43K x 24)
• Package / Case: 64-TFQFP
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 18x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: CAN/I2C/SPI/UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 18-ch x 12-bit
• Controller Family/series: PIC24
• No. Of I/o's: 53
• Ram Memory Size: 8KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM300019 - BOARD DEMO DSPICDEM 80L STARTERDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164327 - MODULE SKT FOR 64TQFP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24H
24.2
The following sections give the technical details of the
packages.
64-Lead Plastic Thin-Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS70175C-page 274
Package Details
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-085
B
c
See ASME Y14.5M
p
Dimension Limits
#leads=n1
E1
E
Units
CH
n1
A2
E1
D1
A1
n
p
A
L
F
E
D
c
B
L
n
MIN
.039
.037
.002
.018
.463
.463
.390
.390
.005
.007
.025
2
1
Preliminary
0
5
5
D1
.039 REF.
INCHES
CH x 45°
NOM
D
.024
.394
.394
.020
.043
.039
.006
.472
.472
.007
.009
.035
3.5
64
16
10
10
A1
A
MAX
.047
.010
.030
.482
.482
.398
.398
.009
.045
.041
.011
F
15
15
7
MIN
11.75
11.75
0.64
1.00
0.95
0.05
0.45
9.90
9.90
0.13
0.17
0
5
5
MILLIMETERS*
1.00 REF.
© 2006 Microchip Technology Inc.
NOM
12.00
12.00
10.00
10.00
0.50
1.10
1.00
0.15
0.60
0.18
0.22
0.89
Revised 07-22-05
3.5
64
16
10
10
MAX
A2
12.25
12.25
10.10
10.10
1.14
1.20
1.05
0.25
0.75
0.23
0.27
15
15
7