DSPIC33FJ64GP802-E/SO Microchip Technology, DSPIC33FJ64GP802-E/SO Datasheet - Page 387
![IC DSPIC MCU/DSP 64K 28-SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
DSPIC33FJ64GP802-E/SO
Manufacturer Part Number
DSPIC33FJ64GP802-E/SO
Description
IC DSPIC MCU/DSP 64K 28-SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ32GP204-IPT.pdf
(14 pages)
2.DSPIC33FJ32GP302-ISO.pdf
(412 pages)
3.DSPIC33FJ64GP804-IML.pdf
(402 pages)
Specifications of DSPIC33FJ64GP802-E/SO
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b/12b, D/A 4x16b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-SOIC (7.5mm Width)
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
21
Flash Memory Size
64KB
Supply Voltage Range
3V To 3.6V
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
10-chx10-bit|10-chx12-bit
On-chip Dac
2-chx16-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164339 - MODULE SKT FOR PM3 28SOICDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- DSPIC33FJ32GP204-IPT PDF datasheet
- DSPIC33FJ32GP302-ISO PDF datasheet #2
- DSPIC33FJ64GP804-IML PDF datasheet #3
- Current page: 387 of 412
- Download datasheet (6Mb)
© 2011 Microchip Technology Inc.
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Units
A2
E1
A2
A1
E1
L1
N
A
E
D
e
h
L
φ
c
b
α
β
α
E
MIN
2.05
0.10
0.25
0.40
0.18
0.31
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
β
8°
–
DS70292E-page 387
c
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