PIC18F242-I/SO Microchip Technology, PIC18F242-I/SO Datasheet - Page 6

• Manufacturer Part Number: PIC18F242-I/SO
• Description: IC MCU FLASH 8KX16 EE A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F242-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 16KB (8K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 23
• Eeprom Size: 256 x 8
• Ram Size: 768 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 768 B
• Interface Type: MSSP/SPI/I2C/PSP/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: PIC18F242I/SO

PIC18FXX2
2. Module: Packaging (Pinout and Product
1.
2.
FIGURE 1:
FIGURE 2:
DS80150D-page 6
PIC18F442 and PICF452 devices are now offered
in 44-pin, near chip-scale micro lead frame
packages (commonly known as “QFN”). This
packaging type has been added to the product line
since the latest revision of the Device Data Sheet.
The addition of this option requires the following
additions to the Device Data Sheet (DS39564B).
The referenced figures and tables follow this text.
The “Pin Diagrams” on pages 2-3 of the Data
Sheet are amended with the addition of the
44-pin QFN pinout, shown in Figure 1.
Table 1-3
replaced with an updated version which adds a
column for QFN pin assignments. A row is also
added for previously unlisted NC pins. All new
information is indicated in bold.
Identification)
of
QFN
PINOUT DIAGRAM FOR PIC18F442/452, 44-PIN QFN PACKAGE
PACKAGE MARKING TEMPLATE FOR PIC18F442/452, 44-PIN QFN
Section 1.0
44-Lead QFN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
RC7/RX/DT
RD4/PSP4
RD5/PSP5
RD6/PSP6
RD7/PSP7
RB0/INT0
RB1/INT1
RB2/INT2
“Overview”
V
V
V
DD
DD
SS
1
2
3
4
5
6
7
8
9
10
11
is
PIC18F442
PIC18F452
3.
4.
5.
Section 24.1 “Package Marking Information”
is amended to include a marking template and
example for 44-pin QFN devices. These are
shown in Figure 2.
Section 24.2 “Package Details” is amended to
include the mechanical drawing of the 44-pin
QFN package following the existing drawings,
shown in Figure 3.
In the “PIC18F442/452 Product Identification
System” (page 329), the “Package” options are
amended to include the new line item:
ML = QFN
For the sake of completeness, it is also noted that
the package designation “MLF” is now replaced by
“QFN” in all occurrences throughout the Device
Data Sheet. “MLF” should be considered an
obsoleted term.
33
32
31
30
29
28
27
26
25
24
23
Example
PIC18F442
-I/ML
0510017
OSC2/CLKO/RA6
OSC1/CLKI
V
V
V
V
RE2/AN7/CS
RE1/AN6/WR
RE0/AN5/RD
RA5/AN4/SS/LVDIN
RA4/T0CKI
SS
SS
DD
DD
© 2005 Microchip Technology Inc.