PIC18F2320-I/SP Microchip Technology, PIC18F2320-I/SP Datasheet - Page 29
![IC MCU FLASH 4KX16 EEPROM 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F2320-I/SP
Manufacturer Part Number
PIC18F2320-I/SP
Description
IC MCU FLASH 4KX16 EEPROM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F1320-ISS.pdf
(36 pages)
3.PIC18F2220-ISO.pdf
(394 pages)
4.PIC18F2220-ISO.pdf
(6 pages)
5.PIC18F2220-ISO.pdf
(6 pages)
6.PIC18F2220-ISO.pdf
(8 pages)
7.PIC18F2220-ISO.pdf
(6 pages)
8.PIC18F2220-ISO.pdf
(6 pages)
9.PIC18F2220-ISP.pdf
(388 pages)
Specifications of PIC18F2320-I/SP
Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SPI/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
25
Number Of Timers
5
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, ICE2000, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
5.4
To allow portability of code, a device programmer is
required to read the Configuration Word locations from
the hex file. If Configuration Word information is not
present in the hex file, then a simple warning message
should be issued. Similarly, while saving a hex file, all
Configuration Word information must be included. An
option to not include the Configuration Word informa-
tion may be provided. When embedding Configuration
Word information in the hex file, it should start at
address 300000h.
Microchip Technology Inc. feels strongly that this
feature is important for the benefit of the end customer.
5.5
To allow portability of code, a device programmer is
required to read the data EEPROM information from
the hex file. If data EEPROM information is not present,
a simple warning message should be issued. Similarly,
when saving a hex file, all data EEPROM information
must be included. An option to not include the data
EEPROM information may be provided. When embed-
ding data EEPROM information in the hex file, it should
start at address F00000h.
Microchip Technology Inc. believes that this feature is
important for the benefit of the end customer.
2010 Microchip Technology Inc.
Embedding Configuration Word
Information in the HEX File
Embedding Data EEPROM
Information in the HEX File
5.6
The checksum is calculated by summing the following:
• The contents of all code memory locations
• The Configuration Word, appropriately masked
• ID locations
The Least Significant 16 bits of this sum are the
checksum.
Table 5-5 describes how to calculate the checksum for
each device.
Note:
PIC18FX220/X320
Checksum Computation
The checksum calculation differs depend-
ing on the code-protect setting. Since the
code memory locations read out differently
depending on the code-protect setting, the
table describes how to manipulate the
actual code memory values to simulate
the values that would be read from a
protected device. When calculating a
checksum by reading a device, the entire
code memory can simply be read and
summed. The Configuration Word and ID
locations can always be read.
DS39592F-page 29