DSPIC30F4013-20I/P Microchip Technology, DSPIC30F4013-20I/P Datasheet - Page 12
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DSPIC30F4013-20I/P
Manufacturer Part Number
DSPIC30F4013-20I/P
Description
IC DSPIC MCU/DSP 48K 40DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20IP.pdf
(26 pages)
2.DSPIC30F3014-30IPT.pdf
(228 pages)
3.DSPIC30F3014-30IPT.pdf
(16 pages)
4.DSPIC30F3014-30IPT.pdf
(6 pages)
5.DSPIC30F3014-30IPT.pdf
(14 pages)
6.DSPIC30F3014-30IPT.pdf
(20 pages)
7.DSPIC30F4013-20EPT.pdf
(220 pages)
Specifications of DSPIC30F4013-20I/P
Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, POR, PWM, WDT
Number Of I /o
30
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F003 - MODULE SOCKET DSPIC30F 40DIPACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F4013-20IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F4013-20I/P
Manufacturer:
Microchip
Quantity:
253
Company:
Part Number:
DSPIC30F4013-20I/P
Manufacturer:
AT
Quantity:
36
Company:
Part Number:
DSPIC30F4013-20I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F4013-20I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F3014/4013
26. Module: I
DS80228K-page 12
Note:
When the I
I2CEN bit in the I2CCON register, the dsPIC DSC
device generates a glitch on the SDA and SCL
pins. This glitch falsely indicates “Communication
Start” to all devices on the I
a bus collision in a multi-master configuration.
Additionally, when the I2CEN bit is set, the S and
P bits of the I
‘0’, respectively, which indicate a “Communication
Start” condition.
Work arounds
To avoid this issue, either of the following two work
arounds can be implemented, depending on the
application requirements.
Work around 1:
In a single-master environment, add a delay
between enabling the I
transmission. The delay should be equal to or
greater than the time it takes to transmit two data
bits.
In the multi-master configuration, in addition to the
delay, all other I
nized and wait for the I
before initiating any kind of communication.
Work around 2:
In dsPIC DSC devices in which the I
multiplexed
precedence in the use of the pin, it is possible to
avoid this glitch by enabling the higher priority
module before enabling the I
Use the following procedure to implement this
work around:
1. Enable the higher priority peripheral module
2. Set up and enable the I
Disable the higher priority peripheral module that
was enabled in step 1.
that is multiplexed on the same pins as the I
module.
Work around 2 works only for devices that
share the SDA and SCL pins with another
peripheral that has a higher precedence
over the port latch, such as the UART. The
priority is shown in the pin diagram located
in the data sheet. For example, if the SDA
and SCL pins are shared with the UART
and SPI pins, and the UART has higher
precedence on the port latch pin.
2
2
C
C module is enabled by setting the
2
with
C module are set to values ‘1’ and
2
C masters should be synchro-
other
2
2
C module and the first data
C module to be initialized
2
2
modules
C module.
C bus, and can cause
2
C module.
2
C module is
that
have
2
C
© 2008 Microchip Technology Inc.