PIC16F876-20/SP Microchip Technology, PIC16F876-20/SP Datasheet - Page 96
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PIC16F876-20/SP
Manufacturer Part Number
PIC16F876-20/SP
Description
IC MCU FLASH 8KX14 EE 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873-04SO.pdf
(218 pages)
5.PIC16F873-04SO.pdf
(5 pages)
6.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F876-20/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/PSP/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
0 C
On-chip Adc
5-ch x 10-bit
Data Rom Size
256 B
A/d Bit Size
10 bit
A/d Channels Available
5
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F876-20/SP
Manufacturer:
MICROCHIP
Quantity:
6 264
Part Number:
PIC16F876-20/SP
Manufacturer:
MIC
Quantity:
20 000
PIC16F87X
9.3
For standard-mode I
resistors R
lowing parameters:
• Supply voltage
• Bus capacitance
• Number of connected devices
The supply voltage limits the minimum value of resistor
R
V
FIGURE 9-27:
DS30292C-page 94
OL
p
(input current + leakage current)
, due to the specified minimum sink current of 3 mA at
Note: I
max = 0.4V, for the specified output stages. For
Connection Considerations for
I
2
C Bus
p
connected.
2
C devices with input levels related to V
and R
s
in Figure 9-27 depend on the fol-
2
SAMPLE DEVICE CONFIGURATION FOR I
C bus devices, the values of
SDA
SCL
R
p
R
DD
p
must have one common supply line to which the pull-up resistor is also
R
s
V
DD
DEVICE
R
+ 10%
s
example, with a supply voltage of V
V
V
desired noise margin of 0.1V
the maximum value of R
and used to improve ESD susceptibility.
The bus capacitance is the total capacitance of wire,
connections, and pins. This capacitance limits the max-
imum value of R
(Figure 9-27).
The SMP bit is the slew rate control enabled bit. This bit
is in the SSPSTAT register, and controls the slew rate
of the I/O pins when in I
OL
DD
max = 0.4V at 3 mA, R
as a function of R
2
C BUS
p
due to the specified rise time
p
2
s
p
C mode (master or slave).
is shown in Figure 9-27. The
. Series resistors are optional
C
2001 Microchip Technology Inc.
min = (5.5-0.4)/0.003 = 1.7 k
b
=10 - 400 pF
DD
for the low level limits
DD
= 5V±10% and