DSPIC30F4011-30I/P Microchip Technology, DSPIC30F4011-30I/P Datasheet - Page 29
![IC DSPIC MCU/DSP 48K 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
DSPIC30F4011-30I/P
Manufacturer Part Number
DSPIC30F4011-30I/P
Description
IC DSPIC MCU/DSP 48K 40DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20IP.pdf
(26 pages)
2.DSPIC30F4012-30ISO.pdf
(238 pages)
3.DSPIC30F4012-30ISO.pdf
(18 pages)
4.DSPIC30F4012-30ISO.pdf
(6 pages)
5.DSPIC30F4012-30ISO.pdf
(16 pages)
6.DSPIC30F4012-30ISO.pdf
(22 pages)
7.DSPIC30F4011-30IP.pdf
(228 pages)
Specifications of DSPIC30F4011-30I/P
Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
30
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F003 - MODULE SOCKET DSPIC30F 40DIPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F4011-30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F4011-30I/P
Manufacturer:
CJ
Quantity:
600 000
Part Number:
DSPIC30F4011-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
ATMEL
Quantity:
3 000
Company:
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
MICROCHIP
Quantity:
455
Company:
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
FIGURE 3-5:
3.2
The core has two data spaces. The data spaces can be
considered either separate (for some DSP instruc-
tions), or as one unified linear address range (for MCU
instructions). The data spaces are accessed using two
Address Generation Units (AGUs) and separate data
paths.
3.2.1
The data space memory is split into two blocks, X and
Y data space. A key element of this architecture is that
Y space is a subset of X space, and is fully contained
within X space. In order to provide an apparent linear
addressing space, X and Y spaces have contiguous
addresses.
2005 Microchip Technology Inc.
Note: PSVPAG is an 8-bit register, containing bits <22:15> of the program space address
BSET
MOV
MOV
MOV
Space
Data
EA
Upper half of Data
Space is mapped
into Program Space
(i.e., it defines the page in program space to which the upper half of data space is being mapped).
Data Address Space
CORCON,#2
#0x00, W0
W0, PSVPAG
0x9200, W0
DATA SPACE MEMORY MAP
16
EA<15> = 0
EA<15> = 1
DATA SPACE WINDOW INTO PROGRAM SPACE OPERATION
15
15
; PSV bit set
; Set PSVPAG register
; Access program memory location
; using a data space access
Data Space
0x8000
15
0xFFFF
0x0000
Preliminary
Concatenation
Address
PSVPAG
0x00
When executing any instruction other than one of the
MAC class of instructions, the X block consists of the 64
Kbyte data address space (including all Y addresses).
When executing one of the MAC class of instructions,
the X block consists of the 64 Kbyte data address
space excluding the Y address block (for data reads
only). In other words, all other instructions regard the
entire data memory as one composite address space.
The MAC class instructions extract the Y address space
from data space and address it using EAs sourced from
W10 and W11. The remaining X data space is
addressed using W8 and W9. Both address spaces are
concurrently accessed only with the MAC class
instructions.
A data space memory map is shown in Figure 3-6.
Figure 3-7 shows a graphical summary of how X and Y
data spaces are accessed for MCU and DSP
instructions.
8
dsPIC30F4011/4012
(1)
23
23
Program Space
15
Data Read
DS70135C-page 27
0
0x007FFE
0x000100
0x001200