PIC18F252-I/SO Microchip Technology, PIC18F252-I/SO Datasheet - Page 12

• Manufacturer Part Number: PIC18F252-I/SO
• Description: IC MCU FLASH 16KX16 EE 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Fr

Specifications of PIC18F252-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 32KB (16K x 16)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 23
• Eeprom Size: 256 x 8
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 1.5 KB
• Interface Type: MSSP/SPI/I2C/PSP/USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 4
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: PIC18F252-I/SOG; PIC18F252-I/SOG; PIC18F252I/SO

PIC18FXX2
FIGURE 3:
DS80173C-page 12
Exposed pad varies according to die attach paddle size.
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
*Controlling Parameter
Notes:
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC equivalent: M0-220
Drawing No. C04-103, Revised 05-05-05
Number of Contacts
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
See ASME Y14.5M
See ASME Y14.5M
A1
44-PIN QFN PACKAGE
Dimension Limits
OPTIONAL PIN 1
TOP MARKING
INDEX ON
TOP VIEW
E
Units
E2
D2
A3
A1
n
p
A
E
D
B
L
DETAIL: CONTACT VARIANTS
(PROFILE MAY VARY)
MIN
n
EXPOSED PAD
.014
.000
.309
.236
.309
.236
.008
.031
2
1
INDEX ON
A3
D
.026 BSC
.010 REF
PIN 1
A
INCHES
NOM
D2
.035
.315
.258
.315
.258
.013
.016
.001
44
1
2
EXPOSED
METAL
MAX
BOTTOM VIEW
PAD
.002
.260
.260
.013
.039
.019
.321
.321
E2
MIN
0.80
7.85
7.85
0.20
0.35
5.99
5.99
0
© 2005 Microchip Technology Inc.
MILLIMETERS*
L
0.65 BSC
0.25 REF
NOM
B
p
0.90
0.02
8.00
6.55
8.00
6.55
0.33
0.40
44
1
2
MAX
1.00
0.05
8.15
6.60
8.15
6.60
0.35
0.48