PIC18F252-I/SP Microchip Technology, PIC18F252-I/SP Datasheet - Page 12
![IC MCU FLASH 16KX16 EE 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC18F252-I/SP
Manufacturer Part Number
PIC18F252-I/SP
Description
IC MCU FLASH 16KX16 EE 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F242-ISO.pdf
(332 pages)
3.PIC18F242-ISO.pdf
(14 pages)
4.PIC18F242-ISO.pdf
(16 pages)
5.PIC18F242-ISO.pdf
(16 pages)
6.PIC18F242-ISO.pdf
(14 pages)
7.PIC18F452-EP.pdf
(332 pages)
Specifications of PIC18F252-I/SP
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
23
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
MSSP/SPI/I2C/PSP/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
23
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DM163022, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5-ch x 10-bit
Package
28SPDIP
Device Core
PIC
Family Name
PIC18
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
PIC18F252-I/SPG
PIC18F252-I/SPG
PIC18F252I/SP
PIC18F252-I/SPG
PIC18F252I/SP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F252-I/SP
Manufacturer:
PANASONIC
Quantity:
35 000
Company:
Part Number:
PIC18F252-I/SP
Manufacturer:
MICP0CRIP
Quantity:
5 510
Part Number:
PIC18F252-I/SP
Manufacturer:
MIC
Quantity:
20 000
PIC18FXX2
FIGURE 3:
DS80173C-page 12
Exposed pad varies according to die attach paddle size.
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
*Controlling Parameter
Notes:
1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC equivalent: M0-220
Drawing No. C04-103, Revised 05-05-05
Number of Contacts
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
See ASME Y14.5M
See ASME Y14.5M
A1
44-PIN QFN PACKAGE
Dimension Limits
OPTIONAL PIN 1
TOP MARKING
INDEX ON
TOP VIEW
E
Units
E2
D2
A3
A1
n
p
A
E
D
B
L
DETAIL: CONTACT VARIANTS
(PROFILE MAY VARY)
MIN
n
EXPOSED PAD
.014
.000
.309
.236
.309
.236
.008
.031
2
1
INDEX ON
A3
D
.026 BSC
.010 REF
PIN 1
A
INCHES
NOM
D2
.035
.315
.258
.315
.258
.013
.016
.001
44
1
2
EXPOSED
METAL
MAX
BOTTOM VIEW
PAD
.002
.260
.260
.013
.039
.019
.321
.321
E2
MIN
0.80
7.85
7.85
0.20
0.35
5.99
5.99
0
© 2005 Microchip Technology Inc.
MILLIMETERS*
L
0.65 BSC
0.25 REF
NOM
B
p
0.90
0.02
8.00
6.55
8.00
6.55
0.33
0.40
44
1
2
MAX
1.00
0.05
8.15
6.60
8.15
6.60
0.35
0.48