PIC18F4610-I/P Microchip Technology, PIC18F4610-I/P Datasheet - Page 362

IC MCU FLASH 32KX16 40DIP

PIC18F4610-I/P

Manufacturer Part Number
PIC18F4610-I/P
Description
IC MCU FLASH 32KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F4610-I/P

Program Memory Type
FLASH
Program Memory Size
64KB (32K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
36
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3968 B
Interface Type
CCP/ECCP/EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163022
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 10-bit
Data Rom Size
3968 B
Height
3.81 mm
Length
52.26 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.2 V
Width
13.84 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD444-1001 - DEMO BOARD FOR PICMICRO MCUACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F4610-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC18F2X1X/4X1X
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39636A-page 360
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
(F)
CH
A2
E1
D1
n1
A1
A
E
D
B
n
p
L
c
n
MIN
Preliminary
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
44
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
 2004 Microchip Technology Inc.
NOM
44
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7

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