PIC18C252-I/SO Microchip Technology, PIC18C252-I/SO Datasheet - Page 286

• Manufacturer Part Number: PIC18C252-I/SO
• Description: IC MCU OTP 16KX16 A/D 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 18Cr

Specifications of PIC18C252-I/SO

• Core Size: 8-Bit
• Program Memory Size: 32KB (16K x 16)
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 1.5K x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Controller Family/series: PIC18
• No. Of I/o's: 24
• Ram Memory Size: 1536Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Interface: I2C, SPI, USART
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC18
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 23
• Interface Type: I2C/SPI/USART
• On-chip Adc: 5-chx10-bit
• Number Of Timers: 4
• Embedded Interface Type: I2C, SPI, USART
• Rohs Compliant: Yes
• Processor Series: PIC18C
• Core: PIC
• Data Ram Size: 1536 B
• Maximum Clock Frequency: 40 MHz
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: ICE2000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MILI3DB18C452 - BOARD DAUGHTER ICEPIC3309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC18CXX2
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
DS39026C-page 284
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
#leads=n1
Dimension Limits
E1
E
Units
CH
A2
(F)
D1
A1
E1
n1
E
D
B
n
p
A
L
c
n
MIN
2
1
.039
.037
.002
.018
.463
.463
.390
.390
.004
.012
.025
D1
0
5
5
L
CH x 45
INCHES
D
NOM
A1
.043
.039
.004
.024
.039
.472
.472
.394
.394
.006
.015
.035
.031
3.5
44
10
10
11
A
MAX
.047
.006
.030
.482
.482
.398
.398
.008
.017
.045
.041
15
15
7
(F)
MIN
11.75
11.75
1.00
0.95
0.05
0.45
1.00
9.90
9.90
0.09
0.30
0.64
0
5
5
MILLIMETERS*
NOM
2001 Microchip Technology Inc.
12.00
12.00
10.00
10.00
0.15
0.80
1.10
1.00
0.10
0.60
0.38
0.89
3.5
44
10
10
11
A2
MAX
12.25
12.25
10.10
10.10
1.20
1.05
0.15
0.75
0.20
0.44
1.14
15
15
7