DSPIC33FJ128GP706A-I/PT Microchip Technology, DSPIC33FJ128GP706A-I/PT Datasheet - Page 21

IC DSPIC MCU/DSP 128K 64-TQFP

DSPIC33FJ128GP706A-I/PT

Manufacturer Part Number
DSPIC33FJ128GP706A-I/PT
Description
IC DSPIC MCU/DSP 128K 64-TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ128GP706A-I/PT

Program Memory Type
FLASH
Program Memory Size
128KB (128K x 8)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
53
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
53
Data Ram Size
16 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
Minimum Operating Temperature
- 40 C
Core Frequency
40MHz
Core Supply Voltage
3.3V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
53
Flash Memory Size
128KB
Supply Voltage Range
3V To 3.6V
Rohs Compliant
Yes
Package
64TQFP
Device Core
dsPIC
Family Name
dsPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
36-chx10-bit|36-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ128GP706A-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Hardware Description
2.3.1
Samples And Processing
Input capture IC
on the dsPIC33F is used to detect if A/D conversion is complete.
1
However, not all MCP3909 device samples are stored in the MCU, depending on the
parameter being calculated. The ADC conversion rate of the MCP3909 device is
determined by the frequency of the master clock (3.378 MHz for the case of a 50 Hz
line), and the output data rate is MCLK/256 or 12.8 ksps. After each conversion is
complete, a Data Ready signal is generated by the SDO of the MCP3909 device. The
signal is fed into IC
, allowing the Interrupt Service Routine (ISR) of IC
to read the
1
1
data. When the MCP3909 device outputs data, it first sends an ADC result of the
voltage channel, then an ADC result of the current channel, with MSB first.
As noted, not all MCP3909 device samples are used for calculating all the parameters.
In practice, 6.4 ksps sampling rate is required, which means only 1 output data is used
for every 2 data sampled. For 50 Hz input signal, 6.4 ksps sampling rate will take 128
samples for each cycle. For example, the active power metering is computed based on
this condition.
But for other parameters for which precision is not critical, such as reactive energy,
voltage, current and frequency, the sampling rate may be reduced to save data storage
space and processing time. In this design, the 3.2 ksps sampling rate is used, which
means only 1 result is stored for every 4 ADC conversions.
After each conversion, a positive pulse with the width of 4 clock cycles is output by the
SDO pin of the MCP3909 device. IC
is used to detect the falling edge of the pulse and
1
generate an interrupt for every 2 falling edges, i.e., 1 data is read for every 2 conver-
sions, thus realizing 6.4 ksps sampling rate.
© 2009 Microchip Technology Inc.
DS51723A-page 21

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