PIC16C72-20I/SP Microchip Technology, PIC16C72-20I/SP Datasheet - Page 112

• Manufacturer Part Number: PIC16C72-20I/SP
• Description: IC MCU OTP 2KX14 A/D PWM 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C72-20I/SP

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Data Converters: A/D 5x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C, SPI, SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 1 x 16 bit
• Operating Supply Voltage: 2.5 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC16C72 Series
16.4
DS39016A-page 112
28-Lead Plastic Surface Mount (SOIC - Wide, 300 mil Body) (SO)
Units
Dimension Limits
Pitch
Number of Pins
Overall Pack. Height
Shoulder Height
Standoff
Molded Package Length
Molded Package Width
Outside Dimension
Chamfer Distance
Shoulder Radius
Gull Wing Radius
Foot Length
Foot Angle
Radius Centerline
Lead Thickness
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
†
‡
*
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B.”
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
Controlling Parameter.
Dimension “B” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
p
n
45
E1
E
R1
X
p
n
A
A1
A2
D
E
E1
X
R1
R2
L
L1
c
B
‡
‡
†
2
1
L1
D
L
MIN
R2
0.093
0.048
0.004
0.700
0.292
0.394
0.010
0.005
0.005
0.011
0.010
0.009
0.014
Preliminary
0
0
0
INCHES*
A2
NOM
A
0.050
0.099
0.058
0.008
0.706
0.296
0.407
0.020
0.005
0.005
0.016
0.015
0.011
0.017
28
12
12
4
MAX
0.104
0.068
0.011
0.712
0.299
0.419
0.029
0.010
0.010
0.021
0.020
0.012
0.019
15
15
8
MIN
17.78
10.01
2.36
1.22
0.10
7.42
0.25
0.13
0.13
0.28
0.25
0.23
0.36
MILLIMETERS
0
0
0
1998 Microchip Technology Inc.
NOM
17.93
10.33
1.27
2.50
1.47
0.19
7.51
0.50
0.13
0.13
0.41
0.38
0.27
0.42
28
12
12
4
MAX
18.08
10.64
A1
2.64
1.73
0.28
7.59
0.74
0.25
0.25
0.53
0.51
0.30
0.48
15
15
8