PIC18F4553-I/P Microchip Technology, PIC18F4553-I/P Datasheet - Page 2
![IC PIC MCU FLASH 16KX16 40-DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F4553-I/P
Manufacturer Part Number
PIC18F4553-I/P
Description
IC PIC MCU FLASH 16KX16 40-DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC18F2458-ISO.pdf
(46 pages)
2.PIC18F2458-ISO.pdf
(6 pages)
3.PIC18F2458-ISO.pdf
(6 pages)
4.PIC18F2458-ISO.pdf
(6 pages)
Specifications of PIC18F4553-I/P
Program Memory Type
FLASH
Program Memory Size
32KB (16K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
34
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
MSSP/I2C/SPI/EUSART/CCP/ECCP
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
35
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM163025
Minimum Operating Temperature
- 40 C
On-chip Adc
13-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163025 - PIC DEM FULL SPEED USB DEMO BRD444-1001 - DEMO BOARD FOR PICMICRO MCU
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F4553-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F4553-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F2458/2553/4458/4553
2. Module: MSSP
3. Module: ECCP (PWM Mode)
DS80336D-page 2
With MSSP in SPI Master mode, F
Timer2/2 clock rate and CKE = 0, a write collision
may occur if SSPBUF is loaded immediately after
the transfer is complete. A delay may be required
after the MSSP Interrupt Flag bit, SSPIF, is set or
the Buffer Full bit, BF, is set and before writing
SSPBUF. If the delay is insufficiently short, a write
collision may occur as indicated by the WCOL bit
being set.
Work around
Add a software delay of one SCK period after
detecting the completed transfer and prior to
updating the SSPBUF contents. Verify the WCOL
bit is clear after writing SSPBUF. If the WCOL is
set, clear the bit in software and rewrite the
SSPBUF register.
Date Codes that pertain to this issue:
All engineering and production devices.
When configured for half-bridge operation with
dead band (CCPxCON<7:6> = 10), the PWM
output may be corrupted for certain values of the
PWM duty cycle. This can occur when these
additional criteria are also met:
• A non-zero dead-band delay is specified
• The duty cycle has a value of 0 through 3, or
Work around
None.
Date Codes that pertain to this issue:
All engineering and production devices.
(PDC6:PDC0 > 0)
4n + 3 (n ≥ 1)
OSC
/64 or
4. Module: Electrical Characteristics (BOR)
5. Module: MSSP (SPI Slave)
Certain operating conditions can move the effec-
tive Brown-out Reset (BOR) threshold outside of
the range specified in the electrical characteristics
of the device data sheet (parameter D005).
The BOR threshold has been observed to increase
with high device operating frequencies, some table
read operations and heavy loading on the USB
voltage regulator. When all of these conditions are
present, BOR has been observed with V
20 percent higher than the V
for a given <BORV1:BORV0> setting.
The BOR threshold may decrease under other
conditions, such as during Sleep, where it may not
occur until V
minimums.
Work around
None.
Date Codes that pertain to this issue:
All engineering and production devices.
If configured in SPI Slave mode, the MSSP may not
successfully recognize data packets generated by an
external master processor. This applies to all SPI
Slave modes (CKE/CKP = 1 or 0), whether or not
slave select is enabled (SSPM3:SSPM0 = 010x).
Work around
Insert a series resistor between the SPI master
Serial Data Out (SDO) and the corresponding SPI
slave Serial Data In (SDI) input line of the
microcontroller. The required value for the resistor
varies with the application system’s characteristics
and
microcontrollers.
Experimentation
encouraged.
Date Codes that pertain to this issue:
All engineering and production devices.
the
process
DD
is 120 mV below the specified
and
© 2008 Microchip Technology Inc.
variations
thorough
BOR
value specified
between
testing
are
the
DD