DSPIC30F6013A-30I/PT Microchip Technology, DSPIC30F6013A-30I/PT Datasheet - Page 223
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DSPIC30F6013A-30I/PT
Manufacturer Part Number
DSPIC30F6013A-30I/PT
Description
IC DSPIC MCU/DSP 132K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F6011A-30IPT.pdf
(234 pages)
3.DSPIC30F6011A-30IPT.pdf
(8 pages)
4.DSPIC30F6011A-30IPT.pdf
(10 pages)
5.DSPIC30F6011A-30IPT.pdf
(6 pages)
6.DSPIC30F6011A-30IPT.pdf
(8 pages)
7.DSPIC30F6011A-30IPT.pdf
(16 pages)
8.DSPIC30F6014A-20EPT.pdf
(238 pages)
9.DSPIC30F6011A-30IPF.pdf
(236 pages)
Specifications of DSPIC30F6013A-30I/PT
Program Memory Type
FLASH
Program Memory Size
132KB (44K x 24)
Package / Case
80-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
68
Data Ram Size
6 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300024, DM330011
Minimum Operating Temperature
- 40 C
Core Frequency
30MHz
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
132KB
Supply Voltage Range
2.5V To 5.5V
Operating Temperature Range
-40°C To
Rohs Compliant
Yes
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC30F007 - MODULE SKT FOR DSPIC30F 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F6013A30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6013A-30I/PT
Manufacturer:
Microchip
Quantity:
1 096
Company:
Part Number:
DSPIC30F6013A-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
APPENDIX A:
Revision A (January 2005)
Original data sheet for dsPIC30F6011A, 6012A, 6013A
and 6014A devices.
Revision B (September 2005)
Revision B of this data sheet reflects these changes:
• 12-Bit ADC allows up to 200 ksps sampling rate
• FRC Oscillator revised to allow tuning in ±0.75%
• Revised electrical characteristics:
Revision C (October 2006)
Revision C of this data sheet reflects these changes:
• BSRAM and SSRAM SFRs added for Data RAM
• Added INTTREG register (see
• Revised I
• Base Instruction CP1 removed from instruction
• Revised electrical characteristics:
© 2011 Microchip Technology Inc.
(see
sion Clock”
increments (see
lator (FRC)”
- Operating Current (I
- Idle Current (I
- Power-Down Current (I
- Brown-Out Reset (BOR) (see
- External Clock Timing Requirements (see
- PLL Clock Timing Specification (V
- PLL Jitter
- Internal FRC Jitter Accuracy and Drift (see
- 12-Bit ADC Module Specifications (see
- 12-Bit ADC Conversion Timing Requirements
protection (see
tion
“Interrupts”)
set (see
- Operating Current (I
- Idle Current (I
- Power-Down Current (I
- I/O Pin Input Specifications (see
- Brown-Out Reset (BOR) (see
- Watchdog Timer (see
Table
5.5 V) (see
Table
Table
(see
Feature”)
Section 19.6 “Selecting the ADC Conver-
Table
23-14)
23-18)
23-38)
Table
2
C Slave Addresses (see
(seeTable
and
and
23-39)
Table
21-2)
Section 3.2.7 “Data Ram Protec-
IDLE
IDLE
Section 20.2.5 “Fast RC Oscil-
Section 19.7 “ADC
Table
23-15)
) (see
) (see
REVISION HISTORY
dsPIC30F6011A/6012A/6013A/6014A
DD
DD
23-16)
20-4).
Table
) (see
) (see
PD
PD
Table
Table
)
)
(seeTable
(seeTable
23-21)
Section 5.0
Table
Table
Table
Table
23-6)
23-6)
Table
Table
DD
23-5)
23-5)
Speeds”),
23-11)
23-11)
= 2.5-
23-7)
23-7)
23-8)
15-1)
Revision D (March 2008)
This revision reflects these updates:
• Added FUSE Configuration Register (FICD)
• Removed erroneous statement regarding genera-
• Electrical Specifications:
• Preliminary marking removed from document
• Additional minor corrections throughout the
details (see
Registers”
tion of CAN receive errors (see
“Receive
- Resolved TBD values for parameters DO10,
- 10-bit High-Speed ADC t
- Parameter OS65 (Internal RC Accuracy) has
- Parameter DC12 (RAM Data Retention Volt-
- Parameter D134 (Erase/Write Cycle Time)
- Removed parameters OS62 (Internal FRC
- Parameter OS63 (Internal FRC Accuracy)
- Updated I/O Pin characteristics parameters
- Removed parameters DC27a, DC27b,
- Removed parameters CS77 and CS78
- Updated Min and Max values and Conditions
footer
document
DO16, DO20, and DO26 (see
ter (time to stabilize) has been updated from
20 µs typical to 20 µs maximum (see
Table
been expanded to reflect multiple Min and
Max values for different temperatures (see
Table
age) has been updated to include a Min value
(see
has been updated to include Min and Max
values and the Typ value has been removed
(see
Jitter) and OS64 (Internal FRC Drift) and
Note 2 from AC Characteristics (see
Table
has been expanded to reflect multiple Min
and Max values for different temperatures
(see
DI19 and DI29 (see
DC47a, and DC47b (references to I
MIPs @ 3.3V) in
(references to T
Table 23-30
for parameter SY11 and updated Min, Typ,
and Max values and Conditions for parame-
ter SY20 (see
Table
Table
Table
23-39)
23-19)
23-18)
Errors”)
Section 20.8 “Device Configuration
and
23-4)
23-12)
23-18)
Table
Table
FACL
Table 23-5
20-8)
Table
23-21)
and T
PDU
23-8)
RACL
and
timing parame-
Section 17.4.5
Table
DS70143E-page 223
@ 3.3V) in
Table 23-6
DD
23-9)
, 20