DSPIC30F6014-30I/PF Microchip Technology, DSPIC30F6014-30I/PF Datasheet - Page 215
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DSPIC30F6014-30I/PF
Manufacturer Part Number
DSPIC30F6014-30I/PF
Description
IC DSPIC MCU/DSP 144K 80TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F6014-20IPF.pdf
(228 pages)
2.DSPIC30F6014-20IPF.pdf
(22 pages)
3.DSPIC30F6014-20IPF.pdf
(28 pages)
Specifications of DSPIC30F6014-30I/PF
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
144KB (48K x 24)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-TQFP, 80-VQFP
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
68
Flash Memory Size
144KB
Supply Voltage Range
2.5V To 5.5V
Package
80TQFP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
68
Interface Type
3-Wire/AC97/CAN/I2C/I2S/SPI/UART
On-chip Adc
16-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1DM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F601430IPF
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6014-30I/PF
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
DSPIC30F6014-30I/PF
Manufacturer:
Microchip
Quantity:
1 207
Company:
Part Number:
DSPIC30F6014-30I/PF
Manufacturer:
MICROCHIP
Quantity:
246
Company:
Part Number:
DSPIC30F6014-30I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F6014-30I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
80-Lead Plastic Thin Quad Flatpack (PF) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
© 2006 Microchip Technology Inc.
Note:
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MS-026
Drawing No. C04-116
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
See ASME Y14.5M
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
c
Dimension Limits
#leads = n1
E1
E
Units
dsPIC30F6011/6012/6013/6014
A2
D1
n1
E1
A1
n
p
A
L
F
E
D
c
B
n
MIN
.037
.002
.018
.004
.011
11°
11°
2
1
0°
L
D1
INCHES
.039 REF.
.630 BSC
.630 BSC
.551 BSC
.551 BSC
A
NOM
A1
D
.026
.039
.024
.013
3.5°
12°
12°
80
20
MAX
(F)
.047
.041
.006
.030
.008
.015
13°
13°
7°
MIN
0.95
0.05
0.45
0.09
0.27
11°
11°
0°
MILLIMETERS*
Revised 7-20-06
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
1.00 REF.
NOM
0.65
1.00
0.60
0.32
3.5°
12°
12°
80
20
DS70117F-page 213
A2
MAX
1.20
1.05
0.15
0.75
0.20
0.37
13°
13°
7°