STM8S105S6T6C STMicroelectronics, STM8S105S6T6C Datasheet - Page 112

• Manufacturer Part Number: STM8S105S6T6C
• Description: MCU 32KB FLASH MEM 16MHZ 44-LQFP
• Manufacturer: STMicroelectronics
• Series: STM8Sr

Specifications of STM8S105S6T6C

• Core Processor: STM8
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 34
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.95 V ~ 5.5 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-LQFP
• Processor Series: STM8S10x
• Core: STM8
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 16 MHz
• Number Of Programmable I/os: 34
• Number Of Timers: 8
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWSTM8
• Development Tools By Supplier: STICE-SYS001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 9 Channel
• For Use With: 497-10040 - EVAL KIT STM8S DISCOVERY497-10593 - KIT STARTER FOR STM8S207/8 SER
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-8949; STM8S105S6T6C

Package information
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SDIP32 package mechanical data
Dim.
Dim.
D
D2
E
E2
e
L
ddd
(1)
A
Values in inches are converted from mm and rounded to 4 decimal digits.
Table 57: 32-lead shrink plastic DIP (400 ml) package mechanical data
mm
Min
mm
Min
4.850
3.200
4.850
3.200
0.300
3.556
Figure 52: 32-lead shrink plastic DIP (400 ml) package
B1
32
1
Typ
Typ
5.000
3.450
5.000
3.450
0.500
0.400
3.759
B
DocID14771 Rev 10
e
A1
A2
A
D D
L
Max
Max
5.150
3.700
5.150
3.700
0.500
0.080
5.080
C
inches
Min
inches
Min
0.1909
0.1260
0.1909
0.1260
0.0118
0.1400
16
17
E1
eA
eB
(1)
E
(1)
76_ME
Typ
Typ
0.1969
0.1969
0.1358
0.0197
0.0157
0.1480
STM8S105xx
Max
Max
0.2028
0.1457
0.2028
0.1457
0.0197
0.0031
0.2000