STM32F101T8U6 STMicroelectronics, STM32F101T8U6 Datasheet - Page 81
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STM32F101T8U6
Manufacturer Part Number
STM32F101T8U6
Description
MCU ARM 32BIT 64K FLASH 36VFQFPN
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F101T8U6.pdf
(87 pages)
Specifications of STM32F101T8U6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
26
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 10x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
36-VFQFN, 36-VFQFPN
Controller Family/series
(ARM Cortex) STM32
No. Of I/o's
26
Ram Memory Size
10KB
Cpu Speed
36MHz
No. Of Timers
3
Embedded Interface Type
I2C, SPI, USART
Rohs Compliant
Yes
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
10 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
26
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 10 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-9032
STM32F101T8U6
STM32F101T8U6
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Part Number
Manufacturer
Quantity
Price
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Quantity:
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STM32F101x8, STM32F101xB
Table 54.
18-Oct-2007
Date
Document revision history (continued)
Revision
3
V
Note added below
characteristics. and below
parameter description modified.
Table 42: ADC characteristics
conditions
Figure 33: ADC accuracy characteristics
Packages are ECOPACK® compliant.
Tables modified in
ADC and ANTI_TAMPER signal names modified (see
density STM32F101xx pin
STM32F101xx pin definitions
updated in
V
Updated:
characteristics.
t
down.
Typical values modified, note 2 modified and note 3 removed in
Low-power mode wakeup
Maximum current consumption
T
T
Handling of unused pins specified in
on page
Table 4: Medium-density STM32F101xx pin
and
Internal LSI RC frequency changed from 32 to 40 kHz (see
oscillator
wakeup
and data
Option byte addresses corrected in
ACC
t
Appendix A: Important notes on page 71
Added:
characteristics.
Note added below
Values added and notes added in
current consumptions in Stop and Standby
On-chip peripheral current consumption on page 43
Package mechanical data inch values are calculated from mm and
rounded to 4 decimal digits (see
V
VDD
JITTER
S_temp
S_vrefint
ESD(CDM)
hys
prog
Note 7
HSI
Doc ID 13586 Rev 14
modified in
modified in
added to
removed from
Figure
added to
timings. N
modified in
54. All I/Os are CMOS and TTL compliant.
added to
retention.
characteristics). Values added to
Table 29: EMS characteristics
modified.
value added to
Table 21: Typical current consumption in Standby
modified.
13,
Table 27: Flash memory
Table 34: I/O static
Table 9: Operating conditions at power-up / power-
Table 46: TS
END
Section 5.3.5: Supply current
Table 11: Embedded internal reference
Figure
Table 10: Embedded reset and power control block
Table 35: Output voltage characteristics
Table 23: HSI oscillator
Table 26: PLL
modified in
14,
timings.
Table 31: ESD absolute maximum
Table 21: HSE 4-16 MHz oscillator
definitions).
Figure 16
modified. Note 4 removed and values
and
characteristics.
Changes
Table
Section 6: Package
Table 15: Typical and maximum
Table 28: Flash memory endurance
Table 44: ADC accuracy - limited test
Figure 8: Memory
characteristics.
General input/output characteristics
characteristics.
12,
Table 4: Medium-density
and
characteristics.
and
modified.
Table 13
added.
Table 25: Low-power mode
modes.
characteristics.
definitions: table clarified
Figure
Table 30: EMI
characteristics.
and
18.
added.
characteristics).
Revision history
map.
Table 4: Medium-
Table 14
voltage.
Table 24: LSI
and V
mode.
ratings.
Table 25:
updated.
OH
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