STM32F101RBT6 STMicroelectronics, STM32F101RBT6 Datasheet - Page 32
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STM32F101RBT6
Manufacturer Part Number
STM32F101RBT6
Description
MCU ARM 128KB FLASH/TIMER 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F101RBT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
36MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F101x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
16 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
36 MHz
Number Of Programmable I/os
64
Number Of Timers
3 x 16 bit
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6059
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Electrical characteristics
5.3
5.3.1
32/87
Table 6.
1. All main power (V
2. Negative injection disturbs the analog performance of the device. See note in
3. Positive injection is not possible on these I/Os. A negative injection is induced by V
4.
5. When several inputs are submitted to a current injection, the maximum ΣI
Table 7.
Operating conditions
General operating conditions
Table 8.
Symbol
V
supply, in the permitted range.
characteristics.
never be exceeded. Refer to
values.
never be exceeded. Refer to
values.
positive and negative injected currents (instantaneous values).
f
f
I
A positive injection is induced by V
f
PCLK1
PCLK2
ΣI
V
DDA
INJ(PIN)
HCLK
Symbol
V
BAT
DD
INJ(PIN)
Symbol
I
I
VDD
VSS
I
T
IO
(1)
STG
T
J
(2)
Current characteristics
Thermal characteristics
General operating conditions
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Total current into V
Total current out of V
Output current sunk by any I/O and control pin
Output current source by any I/Os and control pin
Injected current on five volt tolerant pins
Injected current on any other pin
Total injected current (sum of all I/O and control pins)
DD
, V
Storage temperature range
Maximum junction temperature
DDA
Parameter
) and ground (V
Table 5: Voltage characteristics
Table 5: Voltage characteristics
Doc ID 13586 Rev 14
IN
>V
DD
DD
SS
/V
Ratings
SS
while a negative injection is induced by V
DDA
ground lines (sink)
, V
Ratings
SSA
Must be the same potential
as V
power lines (source)
) pins must always be connected to the external power
DD
(4)
(2)
Conditions
for the maximum allowed input voltage
for the maximum allowed input voltage
(3)
(1)
STM32F101x8, STM32F101xB
(1)
INJ(PIN)
(5)
Section 5.3.17: 12-bit ADC
–65 to +150
is the absolute sum of the
Min
IN
2.4
1.8
Value
IN
150
0
0
0
2
2
<V
<V
SS
SS
-5/+0
. I
Max.
− 25
± 25
150
150
± 5
25
. I
INJ(PIN)
Max
3.6
3.6
3.6
3.6
36
36
36
INJ(PIN)
must
must
Unit
MHz
Unit
Unit
°C
°C
mA
V
V
V