MC9S08LG16CLF Freescale Semiconductor, MC9S08LG16CLF Datasheet - Page 39

• Manufacturer Part Number: MC9S08LG16CLF
• Description: IC MCU 8BIT LG16 FLASH 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08LG16CLF

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LCD, LVD, PWM
• Number Of I /o: 39
• Program Memory Size: 18KB (18K x 8)
• Program Memory Type: FLASH
• Ram Size: 1.9K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: S08LG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 1984 B
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 1
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08LG32
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 12-bit
• Controller Family/series: HCS08
• No. Of I/o's: 39
• Ram Memory Size: 2KB
• Cpu Speed: 40MHz
• Embedded Interface Type: I2C, SCI, SPI
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• For Use With: DEMO9S08LL16 - BOARD DEMO FOR MC9S08LL16 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

3.1
Example of the device numbering system:
4
4.1
The following pages are mechanical drawings for the packages described in
available drawings please visit our web site (http://www.freescale.com) and enter the package’s document
number into the keyword search box.
Freescale Semiconductor
(S = Maskset specific partnumber)
Pin Count
80
64
48
Status/Partnumber Type
Device Numbering System
Package Information
Mechanical Drawings
(9 = FLASH-based)
(MC = Fully Qualified)
(9 = FLASH-based)
Low Quad Flat Package
Low Quad Flat Package
Low Quad Flat Package
Memory
Family
Core
Package Type
Memory
Status
Family
Core
Figure 31. Device Number Example for Auto Parts
Figure 32. Device Number Example for IMM Parts
S
MC
9 S08
MC9S08LG32 Series Data Sheet, Rev. 7
Table 23. Package Descriptions
9 S08
LG 32
LG 32
Abbreviation
J0
LQFP
LQFP
LQFP
X
C
XX
XX
Temperature range
Maskset Identifier Suffix
(First digit usually references wafer fab
Second digit usually differentiates mask rev)
Approximate Flash size in KB
Package designator (see
(C = –40 °C to 85 °C)
(V = –40 °C to 105 °C)
Designator
Temperature range
Package designator (see
Approximate Flash size in KB
(C = –40 °C to 85 °C)
LH
LK
LF
Table
Case No.
917A
840F
932
Table
23. For the latest
Table
23)
Package Information
23)
Document No.
98ASS23237W
98ASS23234W
98ASH00962A
39