C8051F503-IM Silicon Laboratories Inc, C8051F503-IM Datasheet - Page 37
![IC 8051 MCU 64K FLASH 32-QFN](/photos/12/17/121700/c8051f503-im_sml.jpg)
C8051F503-IM
Manufacturer Part Number
C8051F503-IM
Description
IC 8051 MCU 64K FLASH 32-QFN
Manufacturer
Silicon Laboratories Inc
Series
C8051F50xr
Datasheets
1.C8051F507-IM.pdf
(312 pages)
2.C8051F503-IM.pdf
(1 pages)
3.C8051F503-IM.pdf
(312 pages)
Specifications of C8051F503-IM
Program Memory Type
FLASH
Program Memory Size
64KB (64K x 8)
Package / Case
32-QFN
Mfg Application Notes
LIN Bootloader AppNote
Core Processor
8051
Core Size
8-Bit
Speed
50MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
POR, PWM, Temp Sensor, WDT
Number Of I /o
25
Ram Size
4.25K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.25 V
Data Converters
A/D 25x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
C8051F5x
Core
8051
Data Bus Width
8 bit
Data Ram Size
4.25 KB
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F500DK
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 32 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1527 - KIT DEV FOR C8051F50X
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1517-5
- Current page: 37 of 312
- Download datasheet (3Mb)
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60 m minimum, all the way around the pad.
good solder paste release.
Components.
C1
C2
E
Table 4.8. QFP-32 Landing Diagram Dimensions
8.40
8.40
Min
Figure 4.8. QFP-32 Package Drawing
0.80 BSC
Max
8.50
8.50
Rev. 1.2
Dimension
X1
Y1
C8051F50x/F51x
0.40
1.25
Min
Max
0.50
1.35
37
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