MC908AP32CFBE Freescale Semiconductor, MC908AP32CFBE Datasheet - Page 316
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MC908AP32CFBE
Manufacturer Part Number
MC908AP32CFBE
Description
IC MCU 32K FLASH 8MHZ 44QFP
Manufacturer
Freescale Semiconductor
Series
HC08r
Specifications of MC908AP32CFBE
Core Processor
HC08
Core Size
8-Bit
Speed
8MHz
Connectivity
I²C, IRSCI, SCI, SPI
Peripherals
LED, LVD, POR, PWM
Number Of I /o
32
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFP
Controller Family/series
HC08
No. Of I/o's
32
Ram Memory Size
2KB
Cpu Speed
8MHz
No. Of Timers
2
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
Processor Series
HC08AP
Core
HC08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
FSICEBASE, DEMO908AP64E, M68CBL05CE
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC908AP32CFBE
Manufacturer:
Freescale
Quantity:
6
Company:
Part Number:
MC908AP32CFBE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC908AP32CFBE
Manufacturer:
FREESCALE
Quantity:
20 000
Company:
Part Number:
MC908AP32CFBER
Manufacturer:
FREESCALE
Quantity:
5 000
Company:
Part Number:
MC908AP32CFBER
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical Specifications
22.17 Memory Characteristics
314
Data retention voltage
Number of rows per page
Number of bytes per page
Read bus clock frequency
Page erase time
Mass erase time
PGM/ERASE to HVEN setup time
High-voltage hold time
High-voltage hold time (mass erase)
Program hold time
Program time
Address/data setup time
Address/data hold time
Recovery time
Cumulative HV period
Row erase endurance
Row program endurance
Data retention time
1. f
2. If the page erase time is longer than t
3. If the mass erase time is longer than t
4. It is defined as the time it needs before the FLASH can be read after turning off the high voltage charge pump, by clearing
5. t
6. The minimum row endurance value specifies each row of the FLASH memory is guaranteed to work for at least this many
7. The minimum row endurance value specifies each row of the FLASH memory is guaranteed to work for at least this many
8. The FLASH is guaranteed to retain data over the entire operating temperature range for at least the minimum time
memory.
memory.
HVEN to logic 0.
programmed twice before next erase.
erase/program cycles.
erase/program cycle.
specified.
read
hv
is the cumulative high voltage programming time to the same row before next erase, and the same address can not be
is defined as the frequency range for which the FLASH memory can be read.
(8)
(6)
Characteristic
(7)
Table 22-17. Memory Characteristics
MC68HC908AP Family Data Sheet, Rev. 4
erase
me
(Min.), there is no erase-disturb, but it reduces the endurance of the FLASH
(Min.), there is no erase-disturb, but it reduces the endurance of the FLASH
Symbol
t
f
erase
V
read
t
t
t
t
t
me
rcv
t
t
t
t
t
hv
nvh1
prog
RDR
nvh
pgs
ads
adh
—
—
—
nvs
(5)
(3)
(4)
(1)
(2)
Min.
200
100
10k
10k
32k
1.3
20
10
20
20
—
—
10
5
5
1
512
8
Freescale Semiconductor
Max.
8M
40
30
—
—
—
—
—
—
—
—
—
—
—
—
8
Cycles
Cycles
Bytes
Rows
Years
Unit
ms
ms
ms
Hz
µs
µs
µs
µs
µs
µs
V
ns
ns