M30260F6AGP#U5A Renesas Electronics America, M30260F6AGP#U5A Datasheet - Page 16

IC M16C MCU FLASH 48K 48LQFP

M30260F6AGP#U5A

Manufacturer Part Number
M30260F6AGP#U5A
Description
IC M16C MCU FLASH 48K 48LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M16C/Tiny/26r
Datasheet

Specifications of M30260F6AGP#U5A

Core Processor
M16C/60
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, IEBus, SIO, UART/USART
Peripherals
DMA, PWM, Voltage Detect, WDT
Number Of I /o
39
Program Memory Size
48KB (48K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 85°C
Package / Case
48-LQFP
Cpu Family
R8C
Device Core Size
16b
Frequency (max)
20MHz
Interface Type
UART
Total Internal Ram Size
2KB
# I/os (max)
39
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
3V
On-chip Adc
12-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-20C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
48
Package Type
LQFP
Package
48LQFP
Family Name
R8C
Maximum Speed
20 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
39
Number Of Timers
8
For Use With
R0K33026AS000BE - KIT DEV EVALUATION M16C/26A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
M30260F6AGP#U5AM30260F6AGP#D3
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M30260F6AGP#U5AM30260F6AGP#U3
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M30260F6AGP#U5AM30260F6AGP#U3A
Manufacturer:
RENESAS
Quantity:
5 000
Company:
Part Number:
M30260F6AGP#U5AM30260F6AGP#U3A
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Company:
Part Number:
M30260F6AGP#U5AM30260F6AGP#U3A
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Appendix 1. Package Dimensions___________________ 325
Appendix 2. Functional Difference __________________ 326
Register Index __________________________________ 328
19.13 Flash Memory Version .......................................................................................... 320
19.14 Noise ..................................................................................................................... 323
19.15 Instruction for a Device Use .................................................................................. 324
Appendix 2.1 Differences between M16C/26A, M16C/26B, and M16C/26T ................... 326
Appendix 2.2 Differences between M16C/26A Group and M16C/26 Group ................... 327
19.13.1 Functions to Inhibit Rewriting Flash Memory ................................................. 320
19.13.2 Stop mode ...................................................................................................... 320
19.13.3 Wait mode ...................................................................................................... 320
19.13.4 Low power dissipation mode, on-chip oscillator low power dissipation mode... 320
19.13.5 Writing command and data ............................................................................ 320
19.13.6 Program Command ........................................................................................ 320
19.13.7 Operation speed ............................................................................................ 320
19.13.8 Instructions prohibited in EW0 Mode ............................................................. 320
19.13.9 Interrupts ........................................................................................................ 321
19.13.10 How to access .............................................................................................. 321
19.13.11 Writing in the user ROM area ....................................................................... 321
19.13.12 DMA transfer ................................................................................................ 321
19.13.13 Regarding Programming/Erasure Times and Execution Time ..................... 321
19.13.14 Definition of Programming/Erasure Times ................................................... 322
19.13.15 Flash Memory Version Electrical Characteristics 10,000 E/W cycle product .. 322
19.13.16 Boot Mode .................................................................................................... 322
A-7

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