M30833FJGP#U3 Renesas Electronics America, M30833FJGP#U3 Datasheet - Page 79

IC M32C/83 MCU FLASH 100LQFP

M30833FJGP#U3

Manufacturer Part Number
M30833FJGP#U3
Description
IC M32C/83 MCU FLASH 100LQFP
Manufacturer
Renesas Electronics America
Series
M16C™ M32C/80r
Datasheets

Specifications of M30833FJGP#U3

Core Processor
M32C/80
Core Size
16/32-Bit
Speed
32MHz
Connectivity
CAN, I²C, IEBus, SIO, UART/USART
Peripherals
DMA, WDT
Number Of I /o
85
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
31K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 26x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Package
100LQFP
Family Name
R8C
Maximum Speed
32 MHz
Operating Supply Voltage
5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
87
Interface Type
UART
On-chip Adc
26-chx10-bit
On-chip Dac
2-chx8-bit
Number Of Timers
11
For Use With
R0K330879S001BE - KIT DEV RSK M32C/87R0K330879S000BE - KIT DEV RSK M32C/87
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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R
R
M
e
E
3
. v
J
Figure 5.14 V
2
0
C
1
3
4 .
B
8 /
0
1
3
0
1
J
G
3
a
BCLK
MAi
RAS
CASL
CASH
DW
DB
0 -
o r
n
Memory Expansion Mode and Microprocessor Mode
(With 2 wait states, when accessing the DRAM area)
3 .
1
u
NOTES:
Write Timing
t
, 1
4
p
d(BCLK-RAD)
1
1. Varies with operation frequency.
18ns.max
(
2
M
t
CC
0
d(BCLK-DW)
t
t
t
h(RAS-RAD)
RP
su(DB-CAS)
0
3
=3.3V Timing Diagram (5)
6
2
=(tcyc/2 x 3-20)ns.min
Hi-Z
C
18ns.max
8 /
Page 77
, 3
tcyc
Row address
t
=(tcyc-20)ns.min
=(tcyc/2-13)ns.min
h(BCLK-RAD)
t
h(RAS-RAD)
M
3
0ns.min
2
t
18ns.max
d(BCLK-RAS)
C
f o
t
su(DB-CAS)
8 /
9
3
1
) T
(1)
t
d(BCLK-CAD)
18ns.max
(1)
t
d(BCLK-CAS)
18ns.max
Column address
Measurement Conditions:
• V
• Input high and low voltage:
• Output high and low voltage:
CC
V
V
=3.0 to 3.6V
IH
OH
t
=1.5V, V
h(BCLK-CAD)
=1.5V, V
0ns.min
t
t
t
0ns.min
-3ns.min
0ns.min
h(BCLK-RAS)
h(BCLK-CAS)
h(BCLK-DW)
t
-7ns.min
h(BCLK-DB)
IL
OL
=0.5V
=1.5V
t
RP
(1)
Vcc=3.3V

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