PIC16F506-I/P Microchip Technology, PIC16F506-I/P Datasheet - Page 117
![IC PIC MCU FLASH 1KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F506-I/P
Manufacturer Part Number
PIC16F506-I/P
Description
IC PIC MCU FLASH 1KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC12F510-ISN.pdf
(124 pages)
2.PIC16F506-ISL.pdf
(12 pages)
3.PIC16F506-ISL.pdf
(8 pages)
4.PIC16F506-ISL.pdf
(22 pages)
5.PIC16F506-IP.pdf
(114 pages)
Specifications of PIC16F506-I/P
Program Memory Type
FLASH
Program Memory Size
1.5KB (1K x 12)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
11
Ram Size
67 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
67 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
3-ch x 8-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162070 - HEADER INTRFC MPLAB ICD2 8/14P
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F506-I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC12F510/16F506
APPENDIX A:
REVISION HISTORY
Revision A
Original release.
Revision B
Page 3 – Special Microcontroller Features and Low-
Power Features sections.
PIC12F510 Pin Diagram.
Section 3.0 – Figure 3-1, Figure 3-2, Table 3-2,
Table 3-3.
Section 4.0 – First paragraph, Section 4.2 - Figure
references, Tables 4-1 and 4-2 (Note 1).
Section 5.0 – Table 5-2, Table 5-6 Title.
Section 6.0
Section 7.0 – First paragraph, Section 7.7, Register
7-1, Register 7-2, Register 7-3, Figure 7-1, Figure 7-2,
Sections 7.4 through 7.7, Table 7-1.
Section 8.0 – Sections 8.0 through 8.2, Figure 8-1,
Table 8-1.
Section 9.0 – Table 9-2, Register 9-1, Register 9-2,
Table 9-3.
Section 10.0 – Registers 10-1 and 10-2 (Note 1), Table
10-2 (Note 2), Section 10.2.5, Section 10.3,
Table 10-3, Table 10-4, Table 10-5, Section 10.4,
Section 10.5, Section 10.6.1, Section 10.9, 10.9.1,
10.9.2, Section 10.11.
Section 13.0 – 13.1 DC Characteristics, 13.2 DC
Characteristics, Table 13-1, Table 13-3, Table 13-4.
Revision C (03/2007)
Revised Table 3-2 GP3 and Legend; Revised Table 3-
3 RB3 and Legend; Updated Registers to new format;
Revised Section 9.1; Revised Table 9-2; Revised 13.1
DC Characteristics D025; Revised Table 13-2 and
Table 13-3 and Notes; Replaced Package Drawings
(Rev. AN); Added DFN package; Replaced Develop-
ment Support Section; Revised Product ID System.
Revision D (11/2007)
Revised Table 1-1; Table 4-1, Table 4-2; Figure 4-5;
Register 7-1 (Note 1); Register 8-1; Figure 13-4; 13.1 -
13.3; Table 13-1, Table 13-3, Table 13-6, Table 13-7,
Table 13-9; Figure 14-4, Figure 14-14; Section 14.0;
Packaging; Product ID System.
© 2007 Microchip Technology Inc.
DS41268D-page 115