PIC16F636-I/ST Microchip Technology, PIC16F636-I/ST Datasheet - Page 179

• Manufacturer Part Number: PIC16F636-I/ST
• Description: IC MCU FLASH 2KX14 14TSSOP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F636-I/ST

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 14-TSSOP
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, LVD, POR, WDT
• Number Of I /o: 11
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/SPI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Package: 14TSSOP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC162057 - MPLAB ICD 2 HEADER 14DIP
• Eeprom Size: -
• Data Converters: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

15.8
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03 T
TH04 PD
TH05 P
TH06 P
TH07 P
Note 1:
Para
No.
m
2:
3:
JA
JC
Thermal Considerations
J
INTERNAL
I
DER
/
O
Sym
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
= Ambient Temperature.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C
Characteristic
T
A
+125°C
DER
).
PIC12F635
PIC16F636
PIC16F639 108.1
PIC12F635
PIC16F636
PIC16F639 32.2
PIC12F635/PIC16F636/639
163.0
100.4
84.6
52.4
52.4
69.8
85.0
46.3
41.2
38.8
32.5
31.0
31.7
Typ
150
3.0
3.0
2.6
—
—
—
—
Units
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
°C/W 8-pin DFN-S 6x5 mm package
°C/W 14-pin PDIP package
°C/W 14-pin SOIC package
°C/W 14-pin TSSOP package
°C/W 16-pin QFN 4x0.9mm package
°C/W 20-pin SSOP package
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
°C/W 8-pin DFN-S 6x5 mm package
°C/W 14-pin PDIP package
°C/W 14-pin SOIC package
°C/W 14-pin TSSOP package
°C/W 16-pin QFN 4x0.9mm package
°C/W 20-pin SSOP package
°C
W
W
W
W
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
=
= (T
INTERNAL
(I
OL
J
= I
- T
* V
DD
A
Conditions
)/
OL
+ P
x V
JA
) +
DD
I
/
O
DS41232D-page 177
(I
OH
* (V
DD
- V
OH
))