PIC16F785-I/SO Microchip Technology, PIC16F785-I/SO Datasheet - Page 164

• Manufacturer Part Number: PIC16F785-I/SO
• Description: IC PIC MCU FLASH 2KX14 20SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F785-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 20-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 17
• Number Of Timers: 3
• Operating Supply Voltage: 2 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 14-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT20SO1-1 - SOCKET TRANS ICE 20DIP TO 20SOICXLT18SO-1 - SOCKET TRANSITION 18SOIC 300MILAC162060 - HEADER INTRFC MPLAB ICD2 20PINAC164039 - MODULE SKT PROMATE II 20DIP/SOIC
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F785
19.2
The following sections give the technical details of the
packages.
20-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP
DS41249A-page 162
Package Details
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
n
eB
E1
E
Dimension Limits
§
2
1
D
c
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
A1
A
MIN
1.025
Preliminary
.140
.115
.015
.295
.240
.120
.008
.055
.014
.310
5
5
INCHES*
B
B1
NOM
1.033
.100
.155
.130
.310
.250
.130
.012
.060
.018
.370
20
10
10
)
MAX
1.040
.170
.145
.325
.260
.140
.015
.065
.022
.430
15
15
MIN
26.04
3.56
2.92
0.38
7.49
6.10
3.05
0.20
1.40
0.36
7.87
5
5
MILLIMETERS
p
 2004 Microchip Technology Inc.
NOM
26.24
2.54
3.94
3.30
7.87
6.35
3.30
0.29
1.52
0.46
9.40
A2
20
10
10
L
MAX
26.42
10.92
4.32
3.68
8.26
6.60
3.56
0.38
1.65
0.56
15
15