DF2328BVF25V Renesas Electronics America, DF2328BVF25V Datasheet - Page 25

IC H8S MCU FLASH 256K 128QFP

DF2328BVF25V

Manufacturer Part Number
DF2328BVF25V
Description
IC H8S MCU FLASH 256K 128QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of DF2328BVF25V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
87
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
For Use With
EDK2329 - DEV EVALUATION KIT H8S/2329
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
HD64F2328BVF25V

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2328BVF25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Stack Structure: In advanced mode, when the program counter (PC) is pushed onto the stack in a
subroutine call, and the PC, condition-code register (CCR), and extended control register (EXR)
are pushed onto the stack in exception handling, they are stored as shown in figure 1.5. When
EXR is invalid, it is not pushed onto the stack. For details, see the relevant hardware manual.
SP
Notes: 1.
(a) Subroutine Branch
2.
3.
When EXR is not used it is not stored on the stack.
SP when EXR is not used.
Ignored on return.
Reserved
(24 bits)
Figure 1.5 Stack Structure in Advanced Mode
PC
(SP
SP
*2
Rev. 4.00 Feb 24, 2006 page 9 of 322
)
(b) Exception Handling
Reserved
(24 bits)
EXR
CCR
PC
*1
*1 *3
REJ09B0139-0400
Section 1 CPU

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