PIC12F615-I/MS Microchip Technology, PIC12F615-I/MS Datasheet - Page 157
![IC PIC MCU FLASH 1KX14 8MSOP](/photos/6/59/65932/mfg_150_c04-111_ms_8-msop_sml.jpg)
PIC12F615-I/MS
Manufacturer Part Number
PIC12F615-I/MS
Description
IC PIC MCU FLASH 1KX14 8MSOP
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Datasheets
1.PIC12F609T-ISN.pdf
(212 pages)
2.PIC12F609T-ISN.pdf
(26 pages)
3.PIC12F609T-ISN.pdf
(8 pages)
4.PIC12F615-ESN.pdf
(168 pages)
Specifications of PIC12F615-I/MS
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Core Processor
PIC
Speed
20MHz
Number Of I /o
5
Program Memory Type
FLASH
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Controller Family/series
PIC12
No. Of I/o's
6
Ram Memory Size
64Byte
Cpu Speed
20MHz
No. Of Timers
3
Processor Series
PIC12F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
64 B
Interface Type
RS-232, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
5
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 4 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
APGRD004 - REF DESIGN MOD AUTO AMBNT LIGHTAC162083 - HEADER MPLAB ICD2 PIC16F616 8/14AC164325 - MODULE SKT FOR 8MSOPXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFN
Eeprom Size
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12F615-I/MS
Manufacturer:
RICHTEK
Quantity:
5 400
Part Number:
PIC12F615-I/MS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x09 mm Body [DFN]
© 2006 Microchip Technology Inc.
Note:
NOTE 1
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
N
1
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Exposed Pad Width
Overall Width
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
2
D
PIC12F609/615/12HV609/615
Dimension Limits
A1
Preliminary
E
A
Microchip Technology Drawing No. C04–131, Sept. 8, 2006
EXPOSED
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
PAD
NOTE 2
K
MIN
0.80
0.00
0.00
0.00
0.25
0.30
0.20
MILLIMETERS
b
0.80 BSC
0.20 REF
4.00 BSC
4.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
2.20
3.00
0.30
0.55
—
8
D2
2
MAX
1.00
0.05
2.80
3.60
0.35
0.65
e
—
1
N
E2
DS41302A-page 155
NOTE 1
L