PIC16F59-E/P Microchip Technology, PIC16F59-E/P Datasheet - Page 74
![IC PIC MCU FLASH 2KX12 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F59-E/P
Manufacturer Part Number
PIC16F59-E/P
Description
IC PIC MCU FLASH 2KX12 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16F59-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
32
Program Memory Size
3KB (2K x 12)
Program Memory Type
FLASH
Ram Size
134 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
134 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
32
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DV164101, DV164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F59-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC16F5X
DS41213D-page 72
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
α
E1
A2
E
Units
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
φ
2.05
0.10
0.25
0.40
0.20
0.31
MIN
L
0°
5°
5°
–
h
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
h
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
β
© 2007 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
c