PIC16F59-E/P Microchip Technology, PIC16F59-E/P Datasheet - Page 80
![IC PIC MCU FLASH 2KX12 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F59-E/P
Manufacturer Part Number
PIC16F59-E/P
Description
IC PIC MCU FLASH 2KX12 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Specifications of PIC16F59-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
32
Program Memory Size
3KB (2K x 12)
Program Memory Type
FLASH
Ram Size
134 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
134 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
32
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DV164101, DV164120
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F59-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC16F5X
DS41213D-page 78
40-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A1
Note:
A
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
N
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Units
A2
A1
E1
eB
b1
N
D
A
E
e
L
c
b
e
A2
1.980
.125
.015
.590
.485
.115
.008
.030
.014
MIN
E1
–
–
L
.100 BSC
INCHES
NOM
40
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-016B
© 2007 Microchip Technology Inc.
eB
E
2.095
MAX
.250
.195
.625
.580
.200
.015
.070
.023
.700
–
c