PIC16F57-I/SP Microchip Technology, PIC16F57-I/SP Datasheet - Page 22
![IC MCU FLASH 2KX12 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F57-I/SP
Manufacturer Part Number
PIC16F57-I/SP
Description
IC MCU FLASH 2KX12 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F54-ISS.pdf
(88 pages)
2.PIC16F57-ISS.pdf
(16 pages)
3.PIC16F57-ISO.pdf
(86 pages)
Specifications of PIC16F57-I/SP
Program Memory Type
FLASH
Program Memory Size
3KB (2K x 12)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
20
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
72 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
20
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DV164120, DV164101, ICE2000
Minimum Operating Temperature
- 40 C
Data Rom Size
2 K
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164001 - MODULE SKT PROMATEII 18/28DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
PIC16F5X
FIGURE 3-7:
DS41213B-page 20
Bank Select
(FSR)
6
Note 1:
5
Direct Addressing
Location Select
For register map detail, see Section 3.2 “Data Memory Organization”.
Data
Memory
4
DIRECT/INDIRECT ADDRESSING
3
(opcode)
(1)
2
1Fh
00h
0Fh
10h
1
0
Bank 0
00
3Fh
Bank 1
01
Preliminary
Addresses map back to
addresses in Bank 0.
5Fh
Bank 2
10
7Fh
Bank 3
11
2004 Microchip Technology Inc.
6
Indirect Addressing
Bank
5
4
(FSR)
3
Location Select
2
1
0