PIC16F57-I/SP Microchip Technology, PIC16F57-I/SP Datasheet - Page 75
![IC MCU FLASH 2KX12 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F57-I/SP
Manufacturer Part Number
PIC16F57-I/SP
Description
IC MCU FLASH 2KX12 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F54-ISS.pdf
(88 pages)
2.PIC16F57-ISS.pdf
(16 pages)
3.PIC16F57-ISO.pdf
(86 pages)
Specifications of PIC16F57-I/SP
Program Memory Type
FLASH
Program Memory Size
3KB (2K x 12)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
20
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
72 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
20
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DV164120, DV164101, ICE2000
Minimum Operating Temperature
- 40 C
Data Rom Size
2 K
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164001 - MODULE SKT PROMATEII 18/28DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
© 2007 Microchip Technology Inc.
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
A2
E1
Units
A2
A1
E1
L1
N
D
A
E
e
L
c
φ
b
E
c
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
7.80
7.20
1.75
5.30
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
PIC16F5X
8°
–
DS41213D-page 73
φ
L