PIC16F57-I/SP Microchip Technology, PIC16F57-I/SP Datasheet - Page 77
![IC MCU FLASH 2KX12 28-DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F57-I/SP
Manufacturer Part Number
PIC16F57-I/SP
Description
IC MCU FLASH 2KX12 28-DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F54-ISS.pdf
(88 pages)
2.PIC16F57-ISS.pdf
(16 pages)
3.PIC16F57-ISO.pdf
(86 pages)
Specifications of PIC16F57-I/SP
Program Memory Type
FLASH
Program Memory Size
3KB (2K x 12)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
20
Ram Size
72 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
72 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
20
Number Of Timers
1
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
DV164120, DV164101, ICE2000
Minimum Operating Temperature
- 40 C
Data Rom Size
2 K
Height
3.3 mm
Length
34.67 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164001 - MODULE SKT PROMATEII 18/28DIP
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
© 2007 Microchip Technology Inc.
28-Lead Plastic Dual In-Line (P) – 600 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
NOTE 1
A
Note:
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
1 2 3
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
b
b1
D
Dimension Limits
Units
e
A2
A1
E1
eB
b1
N
D
e
A
E
L
b
c
A2
E1
1.380
.125
.015
.590
.485
.115
.008
.030
.014
MIN
–
–
L
.100 BSC
INCHES
NOM
28
–
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-079B
1.565
MAX
.250
.195
.625
.580
.200
.015
.070
.022
.700
PIC16F5X
–
eB
E
DS41213D-page 75
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