PIC12F635-I/MF Microchip Technology, PIC12F635-I/MF Datasheet - Page 215

• Manufacturer Part Number: PIC12F635-I/MF
• Description: IC MCU FLASH 1KX14 8DFN
• Manufacturer: Microchip Technology
• Series: PIC® 12Fr

Specifications of PIC12F635-I/MF

• Core Size: 8-Bit
• Program Memory Size: 1.75KB (1K x 14)
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 5
• Program Memory Type: FLASH
• Eeprom Size: 128 x 8
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DFN
• Controller Family/series: PIC12
• No. Of I/o's: 6
• Eeprom Memory Size: 128Byte
• Ram Memory Size: 64Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFNAC162057 - MPLAB ICD 2 HEADER 14DIPXLT08DFN - SOCKET TRANSITION ICE 8DFNAC164032 - ADAPTER PICSTART PLUS 8DFN/DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
• Data Converters: -
• Connectivity: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

17.2
The following sections give the technical details of the packages.
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
Package Details
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
1
N
2
D
Dimension Limits
3
PIC12F635/PIC16F636/639
e
Units
L
A2
A1
E1
b1
eB
E1
N
A
E
D
e
L
c
b
A2
.015
.290
.240
.348
.115
.008
.040
.014
MIN
.115
–
–
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
–
–
–
Microchip Technology Drawing C04-018B
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c
–
DS41232D-page 213