PIC16F886-E/SO Microchip Technology, PIC16F886-E/SO Datasheet - Page 10
![IC PIC MCU FLASH 8KX14 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F886-E/SO
Manufacturer Part Number
PIC16F886-E/SO
Description
IC PIC MCU FLASH 8KX14 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F886-E/SO
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM164123 - KIT MANAGEMENT SYSTEM PICDEM
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F886-E/SO
Manufacturer:
MICROCHIP
Quantity:
1 200
Part Number:
PIC16F886-E/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC16F88X
8. Module: Asynchronous Timer1
EXAMPLE 3:
DS80302F-page 10
Update:
This Errata supersedes Errata DS80233 and
DS80329.
When TImer1 is started or updated, the timer
needs to see a falling edge from the external clock
source before a rising edge can increment the
counter. If writes to TMR1H and TMR1L are not
completed while the external clock pulse is still
high, Timer1 will not count the first clock pulse
after the update.
When using an external crystal, the pulse width
from rising to falling edge is temperature
dependent and may decrease with temperature.
As a result, the timer may require an additional
oscillation to overflow.
Work around
Switching to the HFINTOSC after reloading, the
timer ensures the Timer1 will see a falling edge
before switching back to the external clock source.
Affected Silicon Revisions
PIC16F882
PIC16F883/PIC16F884
PIC16F886/PIC16F887
BTFSC
GOTO
BTFSS
GOTO
BCF
BSF
BCF
BSF
BCF
Critical Timing of code sequence for instructions following last write to TMR1L or TMR1H.
A0
A0
A2
X
X
X
TMR1L,0
$-1
TMR1L,0
$-1
T1CON,TMR1CS
TMR1H,7
T1CON,TMR1ON
T1CON,TMR1CS
T1CON,TMR1ON
;Timer has just incremented, 31 μs before next rising edge to
;complete reload
;Select HFINTOSC for Timer1
;Timer1 high byte 0x80
;Timer1 off
;Select external crystal
;Timer1 on
Due to the time from Timer1 overflow to the reload
being application specific, wait for the timer to
increment before beginning the reload sequence.
This ensures the timer does not miss a rising edge
during reload.
© 2009 Microchip Technology Inc.