PIC16F688-I/ML Microchip Technology, PIC16F688-I/ML Datasheet - Page 153

• Manufacturer Part Number: PIC16F688-I/ML
• Description: IC PIC MCU FLASH 4KX14 16QFN
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F688-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 7KB (4K x 14)
• Package / Case: 16-QFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 12
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: EUSART/RS- 232/SCI/USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNXLT16QFN1 - SOCKET TRANSITION 14DIP TO 16QFNAC162061 - HEADER INTRFC MPLAB ICD2 20PINAC162056 - HEADER INTERFACE ICD2 16F688
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

14.6
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
JA
JC
J
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
100.4
69.8
85.0
46.3
32.5
31.0
31.7
Typ
150
2.6
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
14-pin PDIP package
14-pin SOIC package
14-pin TSSOP package
16-pin QFN 4x0.9mm package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
PIC16F688
DD
A
Conditions
)/θ
OL
+ P
x V
) + Σ (I
JA
DD
I
/
O
DS41203E-page 151
OH
* (V
DD
- V
OH
))