PIC12CE673-04I/P Microchip Technology, PIC12CE673-04I/P Datasheet - Page 620
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12CE673-04I/P
Manufacturer Part Number
PIC12CE673-04I/P
Description
IC MCU OTP 1KX14 A/D&EE 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(3 pages)
4.PIC12CE673-10P.pdf
(14 pages)
5.PIC12CE673-10P.pdf
(12 pages)
Specifications of PIC12CE673-04I/P
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Oscillator Type
Internal
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Eeprom Size
16 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
16Byte
Ram Memory Size
128Byte
Cpu Speed
4MHz
No.
RoHS Compliant
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12CE673-04I/P
Manufacturer:
Microchip Technology
Quantity:
135
- PIC16F688T-ISL PDF datasheet
- PIC12CE673-10P PDF datasheet #2
- PIC12CE673-10P PDF datasheet #3
- PIC12CE673-10P PDF datasheet #4
- PIC12CE673-10P PDF datasheet #5
- Current page: 620 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
31.3.2
31.3.2.1
DS31031A-page 31-8
2000
1800
1600
1400
1200
1000
I
RC Measurements
DD
800
600
400
200
0
0.0
vs. Frequency
† R = 10 k
‡ R = 5 k
I
taken with all I/O as inputs, either pulled high or low. That is, there are no floating inputs, nor are
any pins driving an output (with a load).
The I
the DCS (Data Collection System). The DCS accurately reflects the device and specified com-
ponent values, that is, it does not add stray capacitance or current.
For the RC measurement, the DCS selects a resistor and capacitor value, and then varies the
voltage over the specified range. As the voltage is changed, the frequency of operation changes.
For a fixed RC, as V
has been taken, the RC value is changed and the measurements are taken again. Each point on
the graph corresponds to a device voltage, resistor value (R), and capacitor value (C).
Figure 31-9:
DD
0.5
is the current (I) that the device consumes when the device is in operating mode. This test is
DD
vs. Frequency charts measure the results on a Microchip automated bench setup, called
1.0
Example Typical I
DD
1.5
increases, the frequency increases. After the measurement, at this RC,
Frequency (MHz)
2.0
DD
†
vs. Frequency (RC Mode @ 22 pF, 25 C)
2.5
3.0
3.5
Shaded area is
beyond recommended range
1997 Microchip Technology Inc.
4.0
‡
4.5
6.0V
5.5V
5.0V
4.5V
4.0V
3.5V
3.0V
2.5V
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