PIC16LF1936-I/SS Microchip Technology, PIC16LF1936-I/SS Datasheet - Page 370
PIC16LF1936-I/SS
Manufacturer Part Number
PIC16LF1936-I/SS
Description
IC PIC MCU FLASH 512KX14 28-SSOP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16LF1933-ISS.pdf
(508 pages)
2.PIC16LF1933-ISS.pdf
(46 pages)
3.PIC16LF1934-IML.pdf
(418 pages)
Specifications of PIC16LF1936-I/SS
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
25
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
EUSART, MI2C, SPI
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
35
Number Of Timers
5
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 14 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16LF1936-I/SS
Manufacturer:
MICROCHI
Quantity:
20 000
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- Download datasheet (7Mb)
PIC16F193X/LF193X
28.6
DS41364A-page 368
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
P
= Junction Temperature
θ
θ
JMAX
= Ambient Temperature
PD
DER
is current to run the chip alone without driving any load on the output pins.
JA
JC
I
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
≤ +125°C
Preliminary
Typ.
27.5
47.2
24.4
31.4
24.7
14.5
150
60
80
90
46
24
24
24
20
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
28-pin SPDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN 6x6mm package
40-pin PDIP package
44-pin TQFP package
44-pin QFN 8x8mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
© 2008 Microchip Technology Inc.
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + Σ (I
- T
DD
I
/
O
A
(1)
)/θ
OH
JA
(2)
* (V
DD
- V
OH
))
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