PIC16F887-E/P Microchip Technology, PIC16F887-E/P Datasheet - Page 32

• Manufacturer Part Number: PIC16F887-E/P
• Description: IC PIC MCU FLASH 8KX14 40DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F887-E/P

• Core Size: 8-Bit
• Program Memory Size: 14KB (8K x 14)
• Mfg Application Notes: Intro to Capacitive Sensing Appl Notes Layout and Physical Design Appl Note
• Core Processor: PIC
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 368 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 35
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 368Byte
• Cpu Speed: 20MHz
• No. Of Timers: 3
• Package: 40PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 2.5|3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 35
• Interface Type: I2C/SPI/USART
• On-chip Adc: 14-chx10-bit
• Number Of Timers: 3
• Processor Series: PIC16F
• Core: PIC
• Data Ram Size: 368 B
• Maximum Clock Frequency: 20 MHz
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 53273-916
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DVA18XP400 - DEVICE ADAPTER 18F4220 PDIP 40LD
• Lead Free Status / Rohs Status: Details

PIC16F88X
TABLE 5-1:
5.3.2
The programmer should be able to read data memory
information from a hex file and conversely (as an
option), write data memory contents to a hex file along
with program memory information and Configuration
Words (0x2007-0x2008) and user ID (0x2000-0x2003)
information.
The physical address range of the 256 data memory is
0x0000-0x00FF. However, these
logically mapped to address 0x2100-0x21FF for use in
writing assembly code. This provides a way of
differentiating between the data and program memory
locations in this range. The format for data memory
storage is one data byte per address location, LSb
aligned. A simple example of data memory is given
below:
DS41287D-page 32
PIC16F882
PIC16F883
PIC16F884
PIC16F886
PIC16F887
Legend: CFG = Configuration Word. Example calculations assume Configuration Word is erased (all ‘1’s).
Device
org 0x2100
de “My Program, v1.0”, 0
SUM[a:b] = [Sum of locations a to b inclusive]
SUM_ID = User ID locations masked by 0xF then made into a 16-bit value with ID0 as the Most Significant
nibble.
*Checksum = [Sum of all the individual expressions] MODULO [0xFFFF]
+ = Addition
& = Bitwise AND
EMBEDDING DATA MEMORY
CONTENTS IN HEX FILE
For example, ID0 = 0x1, ID1 = 0x2, ID3 = 0x3, ID4 = 0x4, then SUM_ID = 0x1234.
The 4 LSbs of the unprotected checksum is used for the example calculations.
Protect
CP = 1
CP = 0
CP = 1
CP = 0
CP = 1
CP = 0
CP = 1
CP = 0
CP = 1
CP = 0
Code
CHECKSUM COMPUTATIONS
SUM[0x0000:0x07FF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x0FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x0FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x1FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
SUM[0x0000:0x1FFF] + (CFG1 & 0x3FFF) + (CFG2 & 0x0700)
(CFG1 & 0x3FFF) + (CFG2 & 0x0700) + SUM_ID
addresses are
Checksum*
 2009 Microchip Technology Inc.
0x7DBE
0x7DBE
0x6DBE
0x6DBE
0x3EFF
0x85BE
0x36FF
0x36FF
0x26FF
0x26FF
Blank
Value
0x25E6 at 0
and Max
Address
0x0ACD
0xF2CD
0xF2CD
0x02CD
0x02CD
0x518C
0x498C
0x498C
0x398C
0x398C