PIC12CE674-10E/P Microchip Technology, PIC12CE674-10E/P Datasheet - Page 22
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC12CE674-10E/P
Manufacturer Part Number
PIC12CE674-10E/P
Description
IC MCU OTP 2KX14 A/D&EE 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(3 pages)
4.PIC12CE673-10P.pdf
(14 pages)
5.PIC12CE673-10P.pdf
(12 pages)
Specifications of PIC12CE674-10E/P
Core Size
8-Bit
Program Memory Size
3.5KB (2K x 14)
Core Processor
PIC
Speed
10MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Eeprom Size
16 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
16Byte
Ram Memory Size
128Byte
Cpu Speed
10MHz
No. Of Timers
1
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
10 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12CE674-10E/P
Manufacturer:
Microchip Technology
Quantity:
135
Company:
Part Number:
PIC12CE674-10E/P
Manufacturer:
MICROCHIP
Quantity:
12 000
- PIC16F688T-ISL PDF datasheet
- PIC12CE673-10P PDF datasheet #2
- PIC12CE673-10P PDF datasheet #3
- PIC12CE673-10P PDF datasheet #4
- PIC12CE673-10P PDF datasheet #5
- Current page: 22 of 688
- Download datasheet (3Mb)
PICmicro MID-RANGE MCU FAMILY
1.5.3.4
1.5.3.5
1.5.3.6
1.5.3.7
DS31001A-page 1-10
UV Erasable Devices
One-Time-Programmable (OTP) Devices
Flash Devices
EEPROM Devices
The UV erasable version of EPROM program memory devices is optimal for prototype develop-
ment and pilot programs.
These devices can be erased and reprogrammed to any of the configuration modes. Third party
programmers are also available; refer to Microchip’s Third Party Guide (DS00104) for a list of
sources.
The amount of time required to completely erase a UV erasable device depends on: the wave-
length of the light, its intensity, distance from UV source, the process technology of the device
(how small are the memory cells).
The availability of OTP devices is especially useful for customers expecting code changes and
updates.
OTP devices, packaged in plastic packages, permit the user to program them once. In addition
to the program and data EPROM memories, the configuration bits must be programmed.
A Flash device allows its memory to be changed by an electric charge. This means that the sys-
tem can be designed so that programming may be performed in-circuit. Since no window is
required, the lower cost plastic packages can used for these devices.
An EEPROM device allows its memory to be erased by an electric charge. This means that the
system can be designed so that erasure and reprogramming may be performed in-circuit. Since
no window is required, the lower cost plastic packages can used for these devices.
Note:
Fluorescent lights and sunlight both emit ultraviolet light at the erasure wavelength.
Leaving a UV erasable device’s window uncovered could cause, over time, the
devices memory cells to become erased. The erasure time for a fluorescent light is
about three years, while sunlight requires only about one week. To prevent the mem-
ory cells from losing data, an opaque label should be placed over the erasure win-
dow.
1997 Microchip Technology Inc.
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