PIC18F44K20-I/P Microchip Technology, PIC18F44K20-I/P Datasheet - Page 12
![IC PIC MCU FLASH 8KX16 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC18F44K20-I/P
Manufacturer Part Number
PIC18F44K20-I/P
Description
IC PIC MCU FLASH 8KX16 40DIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18F25K20T-ISS.pdf
(42 pages)
2.PIC18F25K20T-ISS.pdf
(12 pages)
3.PIC18F25K20T-ISS.pdf
(14 pages)
4.PIC18F25K20T-ISS.pdf
(456 pages)
5.PIC18F26K20-ISO.pdf
(430 pages)
Specifications of PIC18F44K20-I/P
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Eeprom Size
256 x 8
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
CCP/ECCP/EUSART/I2C/MSSP/SPI
Maximum Clock Frequency
64 MHz
Number Of Programmable I/os
36
Number Of Timers
4
Operating Supply Voltage
3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
14-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164112 - VOLTAGE LIMITER MPLAB ICD2 VPPDM164124 - KIT STARTER FOR PIC18F4XK20
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F44K20-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F44K20-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC18F24K20/25K20/44K20/45K20
APPENDIX A:
Rev A Document (12/2008)
Initial release of this document.
Rev B Document (05/2009)
Updated Errata to new format; Added Module 11:
PORTB and Module 12: ADC; minor edits.
Clarifications/Corrections to the Data Sheet: Added
Module 1: MSSP; Module 2: Electrical Specifications;
Module 3: Electrical Specifications.
Rev C Document (06/2009)
Clarifications/Corrections to the Data Sheet:
Deleted Module 1: MSSP: Figure 17-17 Baud Rate
Generator Block Diagram, updating subsequent num-
bering. Added Module 3 MSSP: Register 17-3
SSPADD; Added Module 4 MSSP: Section 17.4.2
Operation; Added Module 5 MSSP: Figure 17-16
MSSP Block Diagram; Added Module 6 MSSP: Sec-
tions 17.4.7.1, 17.4.8, 17.4.9, 17.4.17.1, 17.4.17.2,
17.4.17.3: SSPADD, changing <6:0> to <7:0>.
Rev D Document (11/2009)
Updated to add revision 0x1B.
Data Sheet Clarifications: Deleted Modules 1, 2, 3, 4,
5, 6.
Rev E Document (04/2010)
Updated to include early revisions of silicon, revision
IDs 0xA through 0x11. These early revisions were
described in DS80366 errata, which is now obsolete.
Rev F Document (05/2010)
Updated Table 1.
Rev G Document (07/2010)
Removed ADC Work around #2 and changed #3 to #2
(Module 28).
DS80425G-page 12
DOCUMENT
REVISION HISTORY
2010 Microchip Technology Inc.