DSPIC30F2010-20E/SP Microchip Technology, DSPIC30F2010-20E/SP Datasheet

IC DSPIC MCU/DSP 12K 28DIP

DSPIC30F2010-20E/SP

Manufacturer Part Number
DSPIC30F2010-20E/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F2010-20E/SP

Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2010-20E/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F2010
Data Sheet
High-Performance, 16-Bit
Digital Signal Controllers
© 2006 Microchip Technology Inc.
DS70118G

Related parts for DSPIC30F2010-20E/SP

DSPIC30F2010-20E/SP Summary of contents

Page 1

... Microchip Technology Inc. dsPIC30F2010 Data Sheet High-Performance, 16-Bit Digital Signal Controllers DS70118G ...

Page 2

... Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...

Page 3

... Enhanced Flash 16-Bit Digital Signal Controller Note: This data sheet summarizes features of this group of dsPIC30F devices and is not intended complete reference source. For more information on the CPU, peripherals, register descriptions and general device functionality, refer to the “dsPIC30F Family Reference Manual” ...

Page 4

... This table provides a summary of the dsPIC30F2010 peripheral features. Other available devices in the dsPIC30F Motor Control and Power Conversion Family are shown for feature comparison. DS70118G-page 2 • Detects clock failure and switches to on-chip low- power RC oscillator • Programmable code protection • ...

Page 5

... AN4/QEA/IC7/CN6/RB4 AN5/QEB/IC8/CN7/RB5 OSC1/CLKI OSC2/CLKO/RC15 © 2006 Microchip Technology Inc. MCLR +/CN2/RB0 REF SS -/CN3/RB1 PWM1L/RE0 3 26 REF PWM1H/RE1 4 25 PWM2L/RE2 5 24 PWM2H/RE3 6 23 PWM3L/RE4 PWM3H/RE5 SS OSC1/CLKI PGC/EMUC/U1RX/SDI1/SDA/RF2 PGD/EMUD/U1TX/SDO1/SCL/RF3 FLTA/INT0/SCK1/OCFA/RE8 EMUC2/OC1/IC1/INT1/RD0 1 21 PWM2L/RE2 2 20 PWM2H/RE3 3 19 PWM3L/RE4 dsPIC30F2010 4 18 PWM3H/RE5 PGC/EMUC/U1RX/SDI1/SDA/RF2 dsPIC30F2010 DS70118G-page 3 ...

Page 6

... Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 5 2.0 CPU Architecture Overview.......................................................................................................................................................... 9 3.0 Memory Organization ................................................................................................................................................................. 19 4.0 Address Generator Units ............................................................................................................................................................ 31 5.0 Interrupts .................................................................................................................................................................................... 37 6.0 Flash Program Memory .............................................................................................................................................................. 43 7.0 Data EEPROM Memory ............................................................................................................................................................. 49 8.0 I/O Ports ..................................................................................................................................................................................... 53 9.0 Timer1 Module ........................................................................................................................................................................... 57 10.0 Timer2/3 Module ........................................................................................................................................................................ 61 11.0 Input Capture Module ................................................................................................................................................................. 67 12.0 Output Compare Module ............................................................................................................................................................ 71 13 ...

Page 7

... Programmer’s Reference Manual” (DS70157). © 2006 Microchip Technology Inc. dsPIC30F2010 This document contains device specific information for the dsPIC30F2010 device. The dsPIC30F devices contain extensive Digital Signal Processor (DSP) func- tionality within a high-performance 16-bit microcontroller (MCU) architecture. Figure 1-1 shows a device block diagram for the dsPIC30F2010 device ...

Page 8

... FIGURE 1-1: dsPIC30F2010 BLOCK DIAGRAM Y Data Bus Interrupt PSV & Table Controller Data Access 8 24 Control Block 24 24 PCH PCU Program Counter Stack Loop Address Latch Control Control Logic Logic Program Memory (12 Kbytes) Data EEPROM (1 Kbyte) 16 Data Latch ROM Latch ...

Page 9

... ICD Tertiary Communication Channel clock input/output pin. ICD Quaternary Communication Channel data input/output pin. ICD Quaternary Communication Channel clock input/output pin. Capture inputs. The dsPIC30F2010 has 4 capture inputs. The inputs are numbered for consistency with the inputs on larger device variants. Quadrature Encoder Index Pulse input. ...

Page 10

... TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED) Pin Buffer Pin Name Type Type PGD I/O ST PGC I ST RB0-RB5 I/O ST RC13-RC14 I/O ST RD0-RD1 I/O ST RE0-RE5, I/O ST RE8 RF2, RF3 I/O ST SCK1 I/O ST SDI1 I ST SDO1 O — SS1 I ST SCL I/O ST SDA I/O ...

Page 11

... Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). This document provides a summary dsPIC30F2010 CPU and peripheral function. For a complete description of this functionality, please refer to the “dsPIC30F Family Reference (DS70046). 2.1 Core Overview The core has a 24-bit instruction word ...

Page 12

... Programmer’s Model The programmer’s model is shown in Figure 2-1 and consists of 16x16-bit working registers (W0 through W15), 2x40-bit accumulators (ACCA and ACCB), STATUS Register (SR), Data Table Page register (TBLPAG), Program Space Visibility Page register (PSVPAG), DO and REPEAT registers (DOSTART, DOEND, DCOUNT and RCOUNT) and Program Counter (PC) ...

Page 13

... DCOUNT 0 DOSTART DOEND 15 0 CORCON DC N IPL2 IPL1 IPL0 RA OV SRL dsPIC30F2010 PUSH.S Shadow DO Shadow Legend Working Registers Stack Pointer Limit Register AD0 Program Counter REPEAT Loop Counter DO Loop Counter DO Loop Start Address DO Loop End Address Core Configuration Register Z C STATUS Register ...

Page 14

... Divide Support The dsPIC DSC devices feature a 16/16-bit signed fractional divide operation, as well as 32/16-bit and 16/ 16-bit signed and unsigned integer divide operations, in the form of single instruction iterative divides. The fol- lowing instructions and data sizes are supported: 1. DIVF – 16/16 signed fractional divide 2. DIV.sd – ...

Page 15

... EDAC MAC MAC MOVSAC MPY MPY.N MSC © 2006 Microchip Technology Inc. dsPIC30F2010 The DSP engine has various options selected through various bits in the CPU Core Configuration Register (CORCON), as listed below: 1. Fractional or integer DSP multiply (IF). 2. Signed or unsigned DSP multiply (US). ...

Page 16

... FIGURE 2-2: DSP ENGINE BLOCK DIAGRAM 40 Carry/Borrow Out Carry/Borrow In DS70118G-page 14 40-bit Accumulator A 40-bit Accumulator B Saturate Adder Negate Barrel 16 Shifter 40 Sign-Extend 17-bit Multiplier/Scaler 16 16 To/From W Array Round u Logic Zero Backfill © 2006 Microchip Technology Inc. ...

Page 17

... The OA and OB bits can also optionally generate an arithmetic warning trap when set and the correspond- ing overflow trap flag enable bit (OVATE, OVBTE) in the INTCON1 register (refer to Section 5.0 “Inter- rupts”) is set. This allows the user to take immediate action, for example, to correct system gain. dsPIC30F2010 DS70118G-page 15 ...

Page 18

... The SA and SB bits are modified each time data passes through the adder/subtracter, but can only be cleared by the user. When set, they indicate that the accumulator has overflowed its maximum range (bit 31 for 32-bit sat- uration, or bit 39 for 40-bit saturation) and will be satu- rated (if saturation is enabled) ...

Page 19

... If the SATDW bit in the CORCON register is not set, the input data is always passed through unmodified under all conditions. © 2006 Microchip Technology Inc. dsPIC30F2010 2.4.3 BARREL SHIFTER The barrel shifter is capable of performing up to 15-bit arithmetic or logic right shifts 16-bit left shifts in a single cycle ...

Page 20

... NOTES: DS70118G-page 18 © 2006 Microchip Technology Inc. ...

Page 21

... Microchip Technology Inc. dsPIC30F2010 FIGURE 3-1: PROGRAM SPACE MEMORY MAP FOR dsPIC30F2010 GOTO Reset - Instruction Reset - Target Address Reserved Ext. Osc. Fail Trap Address Error Trap Stack Error Trap Arithmetic Warn ...

Page 22

... TABLE 3-1: PROGRAM SPACE ADDRESS CONSTRUCTION Access Access Type Space Instruction Access User User TBLRD/TBLWT (TBLPAG<7> Configuration TBLRD/TBLWT (TBLPAG<7> Program Space Visibility User FIGURE 3-2: DATA ACCESS FROM PROGRAM SPACE ADDRESS GENERATION Using Program 0 Counter Using 0 PSVPAG Reg Program Space ...

Page 23

... Program Memory ‘Phantom’ Byte (Read as ‘0’). © 2006 Microchip Technology Inc. dsPIC30F2010 A set of Table Instructions are provided to move byte or word-sized data to and from program space. 1. TBLRDL: Table Read Low Word: Read the least significant word of the program address; ...

Page 24

... FIGURE 3-4: PROGRAM DATA TABLE ACCESS (MOST SIGNIFICANT BYTE) PC Address 0x000000 00000000 0x000002 00000000 00000000 0x000004 0x000006 00000000 Program Memory ‘Phantom’ Byte (Read as ‘0’) 3.1.2 DATA ACCESS FROM PROGRAM MEMORY USING PROGRAM SPACE VISIBILITY The upper 32 Kbytes of data space may optionally be mapped into any 16K word program space page ...

Page 25

... The data space memory is split into two blocks, X and Y data space. A key element of this architecture is that Y space is a subset of X space, and is fully contained within X space. In order to provide an apparent linear addressing space, X and Y spaces have contiguous addresses. © 2006 Microchip Technology Inc. dsPIC30F2010 Program Space 0x0000 (1) PSVPAG 0x00 8 ...

Page 26

... FIGURE 3-6: DATA SPACE MEMORY MAP MSB Address 0x0001 SFR Space (Note) 0x07FF 0x0801 512 bytes 0x08FF 0x0901 SRAM Space 0x09FF 0x8001 Optionally Mapped into Program Memory 0xFFFF Note: Unimplemented SFR or SRAM locations read as ‘0’. DS70118G-page 24 16 bits MSB ...

Page 27

... DATA SPACE FOR MCU AND DSP (MAC CLASS) INSTRUCTIONS SFR SPACE (Y SPACE) Non-MAC Class Ops (Read/Write) MAC Class Ops (Write) Indirect EA using any W © 2006 Microchip Technology Inc. dsPIC30F2010 SFR SPACE UNUSED Y SPACE UNUSED UNUSED MAC Class Ops Read-Only Indirect EA using W8, W9 ...

Page 28

... DATA SPACES The X data space is used by all instructions and sup- ports all addressing modes. There are separate read and write data buses. The X read data bus is the return data path for all instructions that view data space as combined X and Y address space also the X address space data path for the dual operand read instructions (MAC class) ...

Page 29

... It pre-decrements for stack pops, and post-increments for stack pushes, as shown in © 2006 Microchip Technology Inc. dsPIC30F2010 Figure 3-9. Note that for a PC push during any CALL instruction, the MSB of the PC is zero-extended before the push, ensuring that the MSB is always clear. ...

Page 30

TABLE 3-3: CORE REGISTER MAP Address SFR Name Bit 15 Bit 14 Bit 13 Bit 12 (Home) W0 0000 W1 0002 W2 0004 W3 0006 W4 0008 W5 000A W6 000C W7 000E W8 0010 W9 0012 W10 0014 W11 ...

Page 31

TABLE 3-3: CORE REGISTER MAP (CONTINUED) Address SFR Name Bit 15 Bit 14 Bit 13 Bit 12 (Home) CORCON 0044 — — — US MODCON 0046 XMODEN YMODEN — XMODSRT 0048 XMODEND 004A YMODSRT 004C YMODEND 004E XBREV 0050 BREN ...

Page 32

... NOTES: DS70118G-page 30 © 2006 Microchip Technology Inc. ...

Page 33

... The contents of a register are accessed directly. The contents of Wn forms the Effective Address (EA). The contents of Wn forms the EA post-modified (incremented or decremented constant value pre-modified (incremented or decremented signed constant value to form the EA. The sum of Wn and a literal forms the EA. dsPIC30F2010 DS70118G-page 31 ...

Page 34

... MCU INSTRUCTIONS The three-operand MCU instructions are of the form: Operand 3 = Operand 1 <function> Operand 2 where Operand 1 is always a working register (i.e., the Addressing mode can only be register direct), which is referred to as Wb. Operand 2 can register, fetched from data memory, or 5-bit literal. The result location can be either a W register or an address location ...

Page 35

... Bidirectional mode, (i.e., address bound- ary checks will be performed on both the lower and upper address boundaries). © 2006 Microchip Technology Inc. dsPIC30F2010 4.2.1 START AND END ADDRESS The Modulo Addressing scheme requires that a starting and an end address be specified and loaded ...

Page 36

... FIGURE 4-1: MODULO ADDRESSING OPERATION EXAMPLE Byte Address 0x1100 0x1163 Start Addr = 0x1100 End Addr = 0x1163 Length = 0x0032 words DS70118G-page 34 MOV #0x1100,W0 MOV W0, XMODSRT ;set modulo start address MOV #0x1163,W0 MOV W0,MODEND ;set modulo end address MOV #0x8001,W0 MOV W0,MODCON ...

Page 37

... Microchip Technology Inc. dsPIC30F2010 If the length of a bit-reversed buffer then the last ‘N’ bits of the data buffer start address must be zeros. XB<14:0> is the bit-reversed address modifier or ‘pivot point’ ...

Page 38

... TABLE 4-3: BIT-REVERSED ADDRESS MODIFIER VALUES FOR XBREV REGISTER Buffer Size (Words) 32768 16384 8192 4096 2048 1024 512 256 128 Note 1: Modifier values greater than 256 words exceed the data memory available on the dsPIC30F2010 device DS70118G-page 36 Decimal XB<14:0> Bit-Reversed Address Modifier Value ...

Page 39

... Manual” (DS70046). For more information on the device instruction set and programming, refer to the “dsPIC30F/ 33F Programmer’s Reference Manual” (DS70157). The dsPIC30F2010 has 24 interrupt sources and 4 processor exceptions (traps), which must be arbitrated based on a priority scheme. The CPU is responsible for reading the Interrupt Vec- tor Table (IVT) and transferring the address contained in the interrupt vector to the program counter ...

Page 40

... For example, the PLVD (Low- Voltage Detect) can be given a priority of 7. The INT0 (external interrupt 0) may be assigned to priority level 1, thus giving it a very low effective priority. DS70118G-page 38 TABLE 5-1: dsPIC30F2010 INTERRUPT VECTOR TABLE INT Vector Interrupt Source Number ...

Page 41

... Trap Lockout: Occurrence of multiple trap conditions simultaneously will cause a Reset. © 2006 Microchip Technology Inc. dsPIC30F2010 5.3 Traps Traps can be considered as non-maskable interrupts indicating a software or hardware error, which adhere to a predefined priority as shown in Figure 5-1. They ...

Page 42

... Address Error Trap: This trap is initiated when any of the following circumstances occurs misaligned data word access is attempted data fetch from an unimplemented data memory location is attempted data access of an unimplemented program memory location is attempted instruction fetch from vector space is attempted. Note: ...

Page 43

... If an enabled interrupt request of sufficient priority is received by the interrupt controller, then the standard interrupt request is presented to the processor. At the same time, the processor will wake-up from Sleep or Idle and begin execution of the Interrupt Service Routine needed to process the interrupt request. dsPIC30F2010 DS70118G-page 41 ...

Page 44

TABLE 5-2: INTERRUPT CONTROLLER REGISTER MAP SFR Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Name INTCON1 0080 NSTDIS — — — — INTCON2 0082 ALTIVT DISI — — — IFS0 0084 CNIF MI2CIF SI2CIF NVMIF ADIF ...

Page 45

... Addressing Using Table Instruction User/Configuration Space Select © 2006 Microchip Technology Inc. dsPIC30F2010 6.2 Run-Time Self-Programming (RTSP) RTSP is accomplished using TBLRD (table read) and TBLWT (table write) instructions. With RTSP, the user may erase program memory, 32 instructions (96 bytes time and can write program memory data, 32 instructions (96 bytes time ...

Page 46

... RTSP Operation The dsPIC30F Flash program memory is organized into rows and panels. Each row consists of 32 instruc- tions bytes. Each panel consists of 128 rows instructions. RTSP allows the user to erase one row (32 instructions time and to program 32 instructions at one time. RTSP may be used to program multiple program memory panels, but the table pointer must be changed at each panel boundary ...

Page 47

... MOV W1 NVMKEY , BSET NVMCON,#WR NOP NOP © 2006 Microchip Technology Inc. dsPIC30F2010 4. Write 32 instruction words of data from data RAM “image” into the program Flash write latches. 5. Program 32 instruction words into program Flash. a) Setup NVMCON register for multi-word, program Flash, program and set WREN bit. ...

Page 48

... LOADING WRITE LATCHES Example 6-2 shows a sequence of instructions that can be used to load the 96 bytes of write latches. 32 TBLWTL and 32 TBLWTH instructions are needed to load the write latches selected by the table pointer. EXAMPLE 6-2: LOADING WRITE LATCHES ; Set up a pointer to the first program memory location to be written ...

Page 49

TABLE 6-1: NVM REGISTER MAP File Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 NVMCON 0760 WR WREN WRERR NVMADR 0762 NVMADRU 0764 — — — NVMKEY 0766 — — — Legend: ...

Page 50

... NOTES: DS70118G-page 48 © 2006 Microchip Technology Inc. ...

Page 51

... A TBLRD instruction reads a word at the current pro- gram word address. This example uses pointer to data EEPROM. The result is placed in register W4, as shown in Example 7-1. EXAMPLE 7-1: MOV #LOW_ADDR_WORD,W0 MOV #HIGH_ADDR_WORD,W1 MOV W1 TBLPAG , TBLRDL [ dsPIC30F2010 DATA EEPROM READ ; Init Pointer ; read data EEPROM DS70118G-page 49 ...

Page 52

... Erasing Data EEPROM 7.2.1 ERASING A BLOCK OF DATA EEPROM In order to erase a block of data EEPROM, the NVMADRU and NVMADR registers must initially point to the block of memory to be erased. Configure NVMCON for erasing a block of data EEPROM, and set the WR and WREN bits in NVMCON register. Set- ting the WR bit initiates the erase, as shown in Example 7-2 ...

Page 53

... Write cycle will complete in 2mS. CPU is not stalled for the Data Write Cycle ; User can poll WR bit, use NVMIF or Timer IRQ to determine write complete © 2006 Microchip Technology Inc. dsPIC30F2010 The write will not initiate if the above sequence is not exactly followed (write 0x55 to NVMKEY, write 0xAA to NVMCON, then set WR bit) for each word ...

Page 54

... WRITING A BLOCK OF DATA EEPROM To write a block of data EEPROM, write to all sixteen latches first, then set the NVMCON register and program the block. EXAMPLE 7-5: DATA EEPROM BLOCK WRITE MOV #LOW_ADDR_WORD,W0 MOV #HIGH_ADDR_WORD,W1 MOV W1 TBLPAG , MOV #data1,W2 [ W0]++ TBLWTL W2 , MOV #data2,W2 ...

Page 55

... I/O cell (pad) to which they are connected. Table 8-1 shows the formats of the registers for the shared ports, PORTB through PORTF. Output Multiplexers 1 Output Enable 0 1 Output Data dsPIC30F2010 I/O Cell I/O Pad Input Data DS70118G-page 53 ...

Page 56

... Configuring Analog Port Pins The use of the ADPCFG and TRIS registers control the operation of the A/D port pins. The port pins that are desired as analog inputs must have their correspond- ing TRIS bit set (input). If the TRIS bit is cleared (out- ...

Page 57

... TABLE 8-1: dsPIC30F2010 PORT REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 TRISB 02C6 — — — — PORTB 02C8 — — — — LATB 02CA — — — — TRISC 02CC TRISC15 TRISC14 TRISC13 — PORTC 02CE RC15 RC14 RC13 — ...

Page 58

... NOTES: DS70118G-page 56 © 2006 Microchip Technology Inc. ...

Page 59

... Interrupt on 16-bit period register match or falling edge of external gate signal © 2006 Microchip Technology Inc. dsPIC30F2010 These operating modes are determined by setting the appropriate bit(s) in the 16-bit SFR, T1CON. Figure 9-1 presents a block diagram of the 16-bit timer module. 16-bit Timer Mode: In the 16-bit Timer mode, the timer ...

Page 60

... FIGURE 9-1: 16-BIT TIMER1 MODULE BLOCK DIAGRAM (TYPE A TIMER) Equal Reset 0 T1IF Event Flag 1 TGATE SOSCO/ T1CK LPOSCEN SOSCI 9.1 Timer Gate Operation The 16-bit timer can be placed in the Gated Time Accu- mulation mode. This mode allows the internal T increment the respective timer when the gate input sig- nal (T1CK pin) is asserted high. Control bit TGATE (T1CON< ...

Page 61

... XTAL SOSCO pF 100K © 2006 Microchip Technology Inc. dsPIC30F2010 9.5.1 RTC OSCILLATOR OPERATION When the TON = 1, TCS = 1 and TGATE = 0, the timer increments on the rising edge of the 32 kHz LP oscilla- tor output signal the value specified in the period register, and is then Reset to ‘0’. ...

Page 62

TABLE 9-1: TIMER1 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 TMR1 0100 PR1 0102 T1CON 0104 TON — TSIDL — Legend uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” (DS70046) for ...

Page 63

... Interrupt on a 32-bit Period Register Match These operating modes are determined by setting the appropriate bit(s) in the 16-bit T2CON and T3CON SFRs. © 2006 Microchip Technology Inc. dsPIC30F2010 For 32-bit timer/counter operation, Timer2 is the least significant word and Timer3 is the most significant word of the 32-bit timer. Note: For 32-bit timer operation, T3CON control bits are ignored ...

Page 64

... FIGURE 10-1: 32-BIT TIMER2/3 BLOCK DIAGRAM Data Bus<15:0> TMR3HLD 16 Write TMR2 Read TMR2 16 Reset TMR3 MSB ADC Event Trigger Comparator x 32 Equal PR3 0 T3IF Event Flag 1 TGATE (T2CON<6>) T2CK Note: Timer Configuration bit T32, T2CON(<3>) must be set to 1 for a 32-bit timer/counter operation. All control bits are respective to the T2CON register ...

Page 65

... Reset 0 T3IF Event Flag 1 TGATE See NOTE Note: The dsPIC30F2010 does not have an external pin input to TIMER3. The following modes should not be used: 1. TCS = 1 2. TCS = 0 and TGATE = 1 (gated time accumulation) © 2006 Microchip Technology Inc. dsPIC30F2010 PR2 TMR2 Q D TGATE ...

Page 66

... Timer Gate Operation The 32-bit timer can be placed in the Gated Time Accu- mulation mode. This mode allows the internal T increment the respective timer when the gate input sig- nal (T2CK pin) is asserted high. Control bit TGATE (T2CON<6>) must be set to enable this mode. When in this mode, Timer2 is the originating clock source ...

Page 67

TABLE 10-1: TIMER2/3 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 TMR2 0106 TMR3HLD 0108 TMR3 010A PR2 010C PR3 010E T2CON 0110 TON — TSIDL — T3CON 0112 TON — TSIDL — ...

Page 68

... NOTES: DS70118G-page 66 © 2006 Microchip Technology Inc. ...

Page 69

... ICxCON register (where x = 1,2,...,N). The dsPIC DSC devices contain capture channels, (i.e., the maximum value 8). Note: The dsPIC30F2010 device has four capture inputs – IC1, IC2, IC7 and IC8. The naming of these four capture chan- nels is intentional and preserves software compatibility with other dsPIC DSC devices ...

Page 70

... Simple Capture Event Mode The simple capture events in the dsPIC30F product family are: • Capture every falling edge • Capture every rising edge • Capture every 4th rising edge • Capture every 16th rising edge • Capture every rising and falling edge These simple Input Capture modes are configured by setting the appropriate bits ICM< ...

Page 71

... Sleep mode. The prescale settings of 4:1 or 16:1 are not applicable in this mode. © 2006 Microchip Technology Inc. dsPIC30F2010 11.2.2 INPUT CAPTURE IN CPU IDLE MODE CPU Idle mode allows input capture module operation with full functionality. In the CPU Idle mode, the interrupt mode selected by the ICI< ...

Page 72

TABLE 11-1: INPUT CAPTURE REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 IC1BUF 0140 IC1CON 0142 — — ICSIDL — IC2BUF 0144 IC2CON 0146 — — ICSIDL — IC3BUF 0148 IC3CON 014A — — ICSIDL ...

Page 73

... Compare registers. In the Dual Compare mode, the OCxR register is used for the first compare and OCxRS is used for the second compare. Set Flag bit OCxIF Output Logic 3 OCM<2:0> Mode Select OCTSEL T3P3_MATCH T2P2_MATCH dsPIC30F2010 S Q OCx R Output Enable OCFA (for and 2) DS70118G-page 71 ...

Page 74

... Timer2 and Timer3 Selection Mode Each output compare channel can select between one of two 16-bit timers: Timer2 or Timer3. The selection of the timers is controlled by the OCTSEL bit (OCxCON<3>). Timer2 is the default timer resource for the Output Compare module. 12.2 Simple Output Compare Match Mode When control bits OCM< ...

Page 75

... The IF bit is located in the IFS0 status register, and must be cleared in software. The interrupt is enabled via the respective timer interrupt enable bit (T2IE or T3IE), located in the IEC0 Control register. The output compare interrupt flag is never set during the PWM mode of operation. dsPIC30F2010 DS70118G-page 73 ...

Page 76

TABLE 12-1: OUTPUT COMPARE REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 OC1RS 0180 OC1R 0182 OC1CON 0184 — OCFRZ OCSIDL — OC2RS 0186 OC2R 0188 OC2CON 018A — OCFRZ OCSIDL — Legend: ...

Page 77

... Figure 13-1 depicts the Quadrature Encoder Interface block diagram. TQCKPS<1:0> TQCS QEIM<2:0> TQGATE CK Q 16-bit Up/Down Counter (POSCNT) 2 Quadrature Encoder Interface Logic Comparator/ Zero Detect 3 QEIM<2:0> Mode Select Max Count Register (MAXCNT) dsPIC30F2010 bits QEIM<2:0> (QEICON<10:8>). 2 Prescaler 1, 8, 64, 256 QEIIF Event Flag Reset Equal DS70118G-page 75 ...

Page 78

... Quadrature Encoder Interface Logic A typical incremental (a.k.a. optical) encoder has three outputs: Phase A, Phase B, and an index pulse. These signals are useful and often required in position and speed control of ACIM and SR motors. The two channels, Phase A (QEA) and Phase B (QEB), have a unique relationship ...

Page 79

... To enable the filter output for channels QEA, QEB and INDX, the QEOUT bit must be ‘1’. The filter network for all channels is disabled on POR and BOR. © 2006 Microchip Technology Inc. dsPIC30F2010 13.5 Alternate 16-bit Timer/Counter When the QEI module is not configured for the QEI mode QEIM< ...

Page 80

... QEI Module Operation During CPU Idle Mode Since the QEI module can function as a quadrature encoder interface 16-bit timer, the following section describes operation of the module in both modes. 13.7.1 QEI OPERATION DURING CPU IDLE MODE When the CPU is placed in the Idle mode, the QEI module will operate if the QEISIDL bit (QEICON< ...

Page 81

TABLE 13-1: QEI REGISTER MAP SFR Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Name QEICON 0122 CNTERR — QEISIDL INDX UPDN QEIM2 QEIM1 QEIM0 SWPAB DFLTCON 0124 — — — — — POSCNT 0126 ...

Page 82

... NOTES: DS70118G-page 80 © 2006 Microchip Technology Inc. ...

Page 83

... PWM I/O pins with 3 duty cycle generators • 16-bit resolution • ‘On-the-Fly’ PWM frequency changes • Edge and Center-Aligned Output modes © 2006 Microchip Technology Inc. dsPIC30F2010 • Single Pulse Generation mode • Interrupt support for asymmetrical updates in Center-Aligned mode • Output override control for Electrically Commutative Motor (ECM) operation • ...

Page 84

... FIGURE 14-1: PWM BLOCK DIAGRAM PWMCON1 PWMCON2 DTCON1 FLTACON OVDCON PTMR Comparator PTPER PTPER Buffer PTCON Comparator SEVTDIR SEVTCMP PWM Time Base Note: Details of PWM Generator #1 and #2 not shown for clarity. DS70118G-page 82 PWM Enable and Mode SFRs Dead-Time Control SFR ...

Page 85

... The interrupt signals generated by the PWM time base depend on the mode selection bits (PTMOD<1:0>) and the postscaler bits (PTOPS<3:0>) in the PTCON SFR. © 2006 Microchip Technology Inc. dsPIC30F2010 14.1.1 FREE RUNNING MODE In the Free Running mode, the PWM time base counts upwards until the value in the Time Base Period regis- ter (PTPER) is matched ...

Page 86

... DOUBLE UPDATE MODE In the Double Update mode (PTMOD<1:0> = 11), an interrupt event is generated each time the PTMR regis- ter is equal to zero, as well as each time a period match occurs. The postscaler selection bits have no effect in this mode of the timer. The Double Update mode provides two additional func- tions to the user ...

Page 87

... PTMR Value 0 Duty Cycle Period © 2006 Microchip Technology Inc. dsPIC30F2010 14.4 Center-Aligned PWM Center-aligned PWM signals are produced by the mod- ule when the PWM time base is configured in an Up/ Down Counting mode (see Figure 14-3). The PWM compare output is driven to the active state ...

Page 88

... DUTY CYCLE REGISTER BUFFERS The four PWM duty cycle registers are double-buffered to allow glitchless updates of the PWM outputs. For each duty cycle, there is a duty cycle register that is accessible by the user and a second duty cycle register that holds the actual compare value used in the present PWM period ...

Page 89

... PWM I/O pins are driven to the inactive state, the PTEN bit is cleared, and an interrupt is generated. © 2006 Microchip Technology Inc. dsPIC30F2010 14.10 PWM Output Override The PWM output override bits allow the user to manu- ally drive the PWM I/O pins to specified logic states, independent of the duty cycle comparison units ...

Page 90

... PWM Output and Polarity Control There are three device Configuration bits associated with the PWM module that provide PWM output pin control: • HPOL Configuration bit • LPOL Configuration bit • PWMPIN Configuration bit These three bits in the FPORBOR Configuration regis- ter (see Section 21) work in conjunction with the three PWM enable bits (PWMEN< ...

Page 91

... Any write to the SEVTCMP register • Any device Reset © 2006 Microchip Technology Inc. dsPIC30F2010 14.15 PWM Operation During CPU Sleep Mode The FLTA A and FLTA B input pins have the ability to wake the CPU from Sleep mode. The PWM module generates an interrupt if either of the FLTA pins is driven low while in Sleep ...

Page 92

TABLE 14-1: PWM REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 PTCON 01C0 PTEN — PTSIDL — PTMR 01C2 PTDIR PTPER 01C4 — SEVTCMP 01C6 SEVTDIR PWMCON1 01C8 — — — — PWMCON2 01CA — ...

Page 93

... Both the transmit buffer (SPIxTXB) and the receive buffer (SPIxRXB) are mapped to the same register address, SPIxBUF. © 2006 Microchip Technology Inc. dsPIC30F2010 In Master mode, the clock is generated by prescaling the system clock. Data is transmitted as soon as a value is written to SPIxBUF. The interrupt is generated at the middle of the transfer of the last bit ...

Page 94

... FIGURE 15-1: SPI BLOCK DIAGRAM Read SPIxBUF Receive SDIx bit 0 SDOx SS & FSYNC Control SSx SCKx Note FIGURE 15-2: SPI MASTER/SLAVE CONNECTION SPI Master Serial Input Buffer (SPIxBUF) Shift Register (SPIxSR) MSb PROCESSOR 1 Note DS70118G-page 92 Internal Data Bus Write SPIxBUF ...

Page 95

... Therefore, when the SSx pin is asserted low again, transmission/reception will begin at the MSb, even if SSx had been de-asserted in the middle of a transmit/receive. © 2006 Microchip Technology Inc. dsPIC30F2010 15.4 SPI Operation During CPU Sleep Mode During Sleep mode, the SPI module is shut down. If ...

Page 96

TABLE 15-1: SPI1 REGISTER MAP SFR Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Name SPI1STAT 0220 SPIEN — SPISIDL — SPI1CON 0222 — FRMEN SPIFSD — DISSDO MODE16 SPI1BUF 0224 Legend uninitialized bit Note: ...

Page 97

... When I2CRSR receives a complete byte transferred to I2CRCV and an interrupt transmission, the I2CTRN is not double-buffered. Note: Following a Restart condition in 10-bit mode, the user only needs to match the first 7-bit address. dsPIC30F2010 2 C Standard and Fast mode 2 C bus MODES 2 C operation are supported: 2 ...

Page 98

... FIGURE 16- BLOCK DIAGRAM Shift SCL Clock SDA Match Detect Stop bit Detect Stop bit Generate Shift Clock DS70118G-page 96 I2CRCV I2CRSR LSB Addr_Match I2CADD Start and Start, Restart, Collision Detect Acknowledge Generation Clock Stretching I2CTRN LSB Reload Control I2CBRG BRG Down ...

Page 99

... ACK received from the master. © 2006 Microchip Technology Inc. dsPIC30F2010 16.3.2 SLAVE RECEPTION If the R_W bit received is a ‘0’ during an address match, then Receive mode is initiated. Incoming bits are sampled on the rising edge of SCL ...

Page 100

... MODE SLAVE TRANSMISSION Once a slave is addressed in this fashion, with the full 10-bit address (we will refer to this state as "PRIOR_ADDR_MATCH"), the master can begin sending data bytes for a slave reception operation. 16.4.2 10-BIT MODE SLAVE RECEPTION Once addressed, the master can generate a Repeated ...

Page 101

... Serial data is received via SDA, while SCL outputs the serial clock. Serial data is received 8 bits at a time. After each byte is received, an ACK bit is transmitted. Start and Stop conditions indicate the 2 C protocol. It beginning and end of transmission. dsPIC30F2010 2 C port to receive data bus will DS70118G-page 99 ...

Page 102

... I C MASTER TRANSMISSION Transmission of a data byte, a 7-bit address or the sec- ond half of a 10-bit address is accomplished by simply writing a value to I2CTRN register. The user should only write to I2CTRN when the module Wait state. This action will set the buffer full flag (TBF) and allow the Baud Rate Generator to begin counting and start the next transmission ...

Page 103

... C OPERATION DURING CPU IDLE MODE 2 For the I C, the I2CSIDL bit selects if the module will stop on Idle or continue on Idle. If I2CSIDL = 0, the module will continue operation on assertion of the Idle mode. If I2CSIDL = 1, the module will stop on Idle. © 2006 Microchip Technology Inc. dsPIC30F2010 DS70118G-page 101 ...

Page 104

TABLE 16-2: I C™ REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 — — — — I2CRCV 0200 — — — — I2CTRN 0202 — — — — I2CBRG 0204 — I2CCON 0206 I2CEN ...

Page 105

... Family Reference Manual” (DS70046). This section describes the Universal Asynchronous Receiver/Transmitter Communications module. Note: Since dsPIC30F2010 devices have only one UART, all references to Ux... imply that only. FIGURE 17-1: UART TRANSMITTER BLOCK DIAGRAM Internal Data Bus ...

Page 106

... FIGURE 17-2: UART RECEIVER BLOCK DIAGRAM LPBACK From UxTX 1 UxRX 0 · Start bit Detect · Parity Check · Stop bit Detect · Shift Clock Generation · Wake Logic Note only. DS70118G-page 104 Internal Data Bus 16 Read Write URX8 UxRXREG Low Byte Receive Buffer Control – ...

Page 107

... The STSEL bit determines whether one or two Stop bits will be used during data transmission. The default (Power-on) setting of the UART is 8 bits, no parity, 1 Stop bit (typically represented 1). © 2006 Microchip Technology Inc. dsPIC30F2010 17.3 Transmitting Data 17.3.1 TRANSMITTING IN 8-BIT DATA MODE ...

Page 108

... TRANSMIT INTERRUPT The transmit interrupt flag (U1TXIF or U2TXIF) is located in the corresponding interrupt flag register. The transmitter generates an edge to set the UxTXIF bit. The condition for generating the interrupt depends on UTXISEL control bit UTXISEL = 0, an interrupt is generated when a word is transferred from the Transmit buffer to the Transmit Shift register (UxTSR) ...

Page 109

... Microchip Technology Inc. dsPIC30F2010 17.7 Loopback Mode Setting the LPBACK bit enables this special mode in which the UxTX pin is internally connected to the UxRX pin ...

Page 110

... UART Operation During CPU Sleep and Idle Modes 17.10.1 UART OPERATION DURING CPU SLEEP MODE When the device enters Sleep mode, all clock sources to the module are shutdown and stay at logic ‘0’. If entry into Sleep mode occurs while a transmission is in progress, then the transmission is aborted. The UxTX pin is driven to logic ‘ ...

Page 111

TABLE 17-1: UART1 REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 U1MODE 020C UARTEN — USIDL — U1STA 020E UTXISEL — — — UTXBRK UTXEN U1TXREG 0210 — — — — U1RXREG 0212 ...

Page 112

... NOTES: DS70118G-page 110 © 2006 Microchip Technology Inc. ...

Page 113

... AN4 AN4 AN5 AN5 AN1 © 2006 Microchip Technology Inc. dsPIC30F2010 The ADC module has six 16-bit registers: • A/D Control Register1 (ADCON1) • A/D Control Register2 (ADCON2) • A/D Control Register3 (ADCON3) • A/D Input Select Register (ADCHS) • A/D Port Configuration Register (ADPCFG) • ...

Page 114

... A/D Result Buffer The module contains a 16-word dual port read-only buffer, called ADCBUF0...ADCBUFF, to buffer the ADC results. The RAM is 10 bits wide, but is read into different format 16-bit words. The contents of the sixteen ADC conversion result buffer registers, ADCBUF0 through ADCBUFF, cannot be written by user software ...

Page 115

... Example 18-1 shows a sample calculation for the ADCS<5:0> bits, assuming a device operating speed of 30 MIPS. EXAMPLE 18-1: (SAMC = AD ADCS<5:0> cycles to AD Therefore, Set ADCS<5:0> Actual T wait is AD dsPIC30F2010 . The source of the A/D CONVERSION CLOCK * (0.5 * (ADCS<5:0> ADCS<5:0> – time AD = 5V) ...

Page 116

... A/D Conversion Speeds The dsPIC30F 10-bit ADC specifications permit a maximum 1 Msps sampling rate. summarizes the conversion speeds for the dsPIC30F 10-bit ADC and the required operating conditions. TABLE 18-1: 10-BIT A/D CONVERSION RATE PARAMETERS dsPIC30F 10-bit A/D Converter Conversion Rates ...

Page 117

... Configure the A/D clock period to be 1,000,000 by writing to the ADCS<5:0> control bits in the ADCON3 register • Configure the sampling time writing: SAMC<4:0> = 00010 • Select at least two channels per analog input pin by writing to the ADCHS register dsPIC30F2010 and V - pins following REF ...

Page 118

... CONFIGURATION GUIDELINE The following configuration items are required to achieve a 750 ksps conversion rate. This configuration assumes that a single analog input sampled. • Comply with conditions provided in Table 18-2 • Connect external V + and V - pins following REF REF the recommended circuit shown in Figure 18-2 • ...

Page 119

... Refer to the Electrical Specifications for T requirements. . The combined 250 IC Sampling Switch leakage V = 0.6V T 500 nA negligible if Rs PIN dsPIC30F2010 period of sampling AD and sample time HOLD = DAC capacitance = 4 DS70118G-page 117 ...

Page 120

... Module Power-Down Modes The module has 3 internal power modes. When the ADON bit is ‘1’, the module is in Active mode fully powered and functional. When ADON is ‘0’, the module is in Off mode. The digital and analog portions of the circuit are disabled for maximum current savings ...

Page 121

... ANx pins), may cause the input buffer to consume current that exceeds the device specifications. © 2006 Microchip Technology Inc. dsPIC30F2010 18.14 Connection Considerations The analog inputs have diodes to V protection. This requires that the analog input be between V ...

Page 122

TABLE 18-2: ADC REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 ADCBUF0 0280 — — — — ADCBUF1 0282 — — — — ADCBUF2 0284 — — — — ADCBUF3 0286 — — — — ...

Page 123

... In the Idle mode, the clock sources are still active, but the CPU is shut off. The RC oscillator option saves system cost, while the LP crystal option saves power. © 2006 Microchip Technology Inc. dsPIC30F2010 19.1 Oscillator System Overview The dsPIC30F oscillator system has the following modules and features: • ...

Page 124

... TABLE 19-1: OSCILLATOR OPERATING MODES Oscillator Mode XTL 200 kHz-4 MHz crystal on OSC1:OSC2 MHz-10 MHz crystal on OSC1:OSC2 PLL 4x 4 MHz-10 MHz crystal on OSC1:OSC2. 4x PLL enabled PLL 8x 4 MHz-10 MHz crystal on OSC1:OSC2. 8x PLL enabled PLL 16x 4 MHz-10 MHz crystal on OSC1:OSC2. 16x PLL enabled ...

Page 125

... FIGURE 19-1: OSCILLATOR SYSTEM BLOCK DIAGRAM OSC1 Primary Oscillator OSC2 POR Done SOSCO 32 kHz LP Oscillator SOSCI © 2006 Microchip Technology Inc. dsPIC30F2010 F PLL PLL x4, x8, x16 PLL Lock Primary Osc Primary Oscillator Stability Detector Oscillator Start-up Clock Timer Switching and Control ...

Page 126

... Oscillator Configurations 19.2.1 INITIAL CLOCK SOURCE SELECTION While coming out of Power-on Reset or Brown-out Reset, the device selects its clock source based on: a) FOS<1:0> Configuration bits that select one of four oscillator groups. b) AND FPR<3:0> Configuration bits that select one of 13 oscillator choices within the primary group. ...

Page 127

... PWRT expires. Note 1: OSC2 pin function is determined by the Primary (FPR<3:0>). 2: OSC1 pin cannot be used as an I/O pin even if the secondary oscillator or an internal clock source is selected at all times. dsPIC30F2010 FRC TUNING FRC Frequency + 10.5% + 9.0% + 7.5% + 6. ...

Page 128

... FAIL-SAFE CLOCK MONITOR The Fail-Safe Clock Monitor (FSCM) allows the device to continue to operate even in the event of an oscillator failure. The FSCM function is enabled by appropriately programming the FCKSM Configuration bits (Clock Switch and Monitor Selection bits) in the F Configuration register. If the FSCM function is ...

Page 129

... Reset The dsPIC30F2010 differentiates between various kinds of Reset: a) Power-on Reset (POR) b) MCLR Reset during normal operation c) MCLR Reset during Sleep d) Watchdog Timer (WDT) Reset (during normal operation) e) Programmable Brown-out Reset (BOR) f) RESET Instruction g) Reset cause by trap lockup (TRAPR) h) Reset caused by illegal opcode using an ...

Page 130

... FIGURE 19-3: TIME-OUT SEQUENCE ON POWER-UP (MCLR TIED MCLR INTERNAL POR OST TIME-OUT PWRT TIME-OUT INTERNAL Reset FIGURE 19-4: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED MCLR INTERNAL POR OST TIME-OUT PWRT TIME-OUT INTERNAL Reset FIGURE 19-5: TIME-OUT SEQUENCE ON POWER-UP (MCLR NOT TIED TO V ...

Page 131

... The BOR voltage trip points indicated here are nominal values provided for design guidance only. © 2006 Microchip Technology Inc. dsPIC30F2010 A BOR will generate a Reset pulse which will reset the device. The BOR will select the clock source, based on the device Configuration bit values (FOS<1:0> and FPR< ...

Page 132

... Table 19-5 shows the Reset conditions for the RCON Register. Since the control bits within the RCON regis- ter are R/W, the information in the table implies that all the bits are negated prior to the action specified in the condition column. TABLE 19-5: ...

Page 133

... FRC oscillator will be enabled, and the user will have to re-enable the crystal oscillator. If FSCM is not enabled, then the device will simply suspend execution of code until the clock is stable, and will remain in Sleep until the oscillator clock has started. dsPIC30F2010 , T and T delays POR LOCK PWRT ...

Page 134

... All Resets will wake-up the processor from Sleep mode. Any Reset, other than POR, will set the Sleep status bit POR, the Sleep bit is cleared. If Watchdog Timer is enabled, then the processor will wake-up from Sleep mode upon WDT time-out. The Sleep and WDTO status bits are both set ...

Page 135

TABLE 19-7: SYSTEM INTEGRATION REGISTER MAP SFR Name Addr. Bit 15 Bit 14 Bit 13 Bit 12 RCON 0740 TRAPR IOPUWR BGST — OSCCON 0742 TUN3 TUN2 COSC<1:0> Legend uninitialized bit Note: Refer to “dsPIC30F Family Reference Manual” ...

Page 136

... NOTES: DS70118G-page 134 © 2006 Microchip Technology Inc. ...

Page 137

... All instructions are a single word, except for certain double word instructions, which were made double word instructions so that all the required information is available in these 48 bits. In the second word, the 8 MSbs are ‘0’s. If this second word is executed as an instruction (by itself), it will execute as a NOP. dsPIC30F2010 DS70118G-page 135 ...

Page 138

... Most single-word instructions are executed in a single instruction cycle, unless a conditional test is true or the program counter is changed as a result of the instruc- tion. In these cases, the execution takes two instruction cycles with the additional instruction cycle(s) executed as a NOP. Notable exceptions are the BRA (uncondi- ...

Page 139

... Wy {[W10 [W10 [W10 [W10], [W10 [W10 [W10 [W11 [W11 [W11 [W11], [W11 [W11 [W11 [W11 + W12], none} Y data space prefetch destination register for DSP instructions Wyd © 2006 Microchip Technology Inc. dsPIC30F2010 Description {W0..W15} { Wd, [Wd], [Wd++], [Wd--], [++Wd], [--Wd] } {W0..W15} {W0..W15} {W0..W15} { Ws, [Ws], [Ws++], [Ws--], [++Ws], [--Ws] } {W4 ...

Page 140

... TABLE 20-2: INSTRUCTION SET OVERVIEW Base Assembly Instr Assembly Syntax Mnemonic # 1 ADD ADD Acc ADD f ADD f,WREG ADD #lit10,Wn ADD Wb,Ws,Wd ADD Wb,#lit5,Wd ADD Wso,#Slit4,Acc 2 ADDC ADDC f ADDC f,WREG ADDC #lit10,Wn ADDC Wb,Ws,Wd ADDC Wb,#lit5,Wd 3 AND AND f AND f,WREG ...

Page 141

... DO Wn,Expr Wm*Wm,Acc,Wx,Wy,Wxd 33 EDAC EDAC Wm*Wm,Acc,Wx,Wy,Wxd © 2006 Microchip Technology Inc. dsPIC30F2010 # of Description word Bit Test f, Skip if Set Bit Test Ws, Skip if Set Bit Test f Bit Test Bit Test Bit Test Ws<Wb> Bit Test Ws<Wb> Bit Test then Set f Bit Test then Set ...

Page 142

... TABLE 20-2: INSTRUCTION SET OVERVIEW (CONTINUED) Base Assembly Instr Assembly Syntax Mnemonic # 34 EXCH EXCH Wns,Wnd 35 FBCL FBCL Ws,Wnd 36 FF1L FF1L Ws,Wnd 37 FF1R FF1R Ws,Wnd 38 GOTO GOTO Expr GOTO Wn 39 INC INC f INC f,WREG INC Ws,Wd 40 INC2 INC2 f INC2 f,WREG INC2 ...

Page 143

... SFTAC Acc,#Slit6 f,WREG SL Ws,Wd SL Wb,Wns,Wnd SL Wb,#lit5,Wnd © 2006 Microchip Technology Inc. dsPIC30F2010 # of Description word Negate Accumulator WREG = Operation No Operation Pop f from Top-of-Stack (TOS) Pop from Top-of-Stack (TOS) to Wdo Pop from Top-of-Stack (TOS) to W(nd):W( Pop Shadow Registers Push f to Top-of-Stack (TOS) ...

Page 144

... TABLE 20-2: INSTRUCTION SET OVERVIEW (CONTINUED) Base Assembly Instr Assembly Syntax Mnemonic # 72 SUB SUB Acc SUB f SUB f,WREG SUB #lit10,Wn SUB Wb,Ws,Wd SUB Wb,#lit5,Wd 73 SUBB SUBB f SUBB f,WREG SUBB #lit10,Wn SUBB Wb,Ws,Wd SUBB Wb,#lit5,Wd 74 SUBR SUBR f SUBR f,WREG SUBR Wb,Ws,Wd ...

Page 145

... MPLAB PM3 Device Programmer - PICkit™ 2 Development Programmer • Low-Cost Demonstration and Development Boards and Evaluation Kits © 2006 Microchip Technology Inc. dsPIC30F2010 21.1 MPLAB Integrated Development Environment Software The MPLAB IDE software brings an ease of software development previously unseen in the 8/16-bit micro- controller market ...

Page 146

... MPASM Assembler The MPASM Assembler is a full-featured, universal macro assembler for all PIC MCUs. The MPASM Assembler generates relocatable object files for the MPLINK Object Linker, Intel files, MAP files to detail memory usage and symbol reference, absolute LST files that contain source lines and generated machine code and COFF files for debugging ...

Page 147

... The PC platform and Microsoft Windows 32-bit operating system were chosen to best make these features available in a simple, unified application. © 2006 Microchip Technology Inc. dsPIC30F2010 21.9 MPLAB ICD 2 In-Circuit Debugger Microchip’s In-Circuit Debugger, MPLAB ICD powerful, low-cost, ...

Page 148

... PICSTART Plus Development Programmer The PICSTART Plus Development Programmer is an easy-to-use, low-cost, prototype programmer. It connects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient. The PICSTART Plus Development Programmer supports most PIC devices in DIP packages pins. ...

Page 149

... Microchip Technology Inc. (except V and MCLR) ................................................... -0. (Note 1) ......................................................................................... 0V to +13.25V ) .......................................................................................................... ± > ...................................................................................................± pin, inducing currents greater than 80 mA, may cause latchup dsPIC30F2010-30I 30 — 20 — 10 dsPIC30F2010 + 0.3V) DD pin, rather PP Max MIPS dsPIC30F2010-20E — 20 — 15 — DS70118G-page 147 ...

Page 150

... TABLE 22-2: THERMAL OPERATING CONDITIONS Rating dsPIC30F2010-30I Operating Junction Temperature Range Operating Ambient Temperature Range dsPIC30F2010-20E Operating Junction Temperature Range Operating Ambient Temperature Range Power Dissipation: Internal chip power dissipation: ∑ – I INT I/O Pin power dissipation: ∑ – Maximum Allowed Power Dissipation ...

Page 151

... All I/O pins are configured as inputs and pulled to V MCLR = V , WDT, FSCM, LVD and BOR are disabled. CPU, SRAM, Program Memory and Data DD Memory are operational. No peripheral modules are operating. © 2006 Microchip Technology Inc. dsPIC30F2010 ) DD Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40° ...

Page 152

... TABLE 22-6: DC CHARACTERISTICS: IDLE CURRENT (I DC CHARACTERISTICS Parameter Typical Max No. (1) Operating Current ( DC51a 1.5 3.0 DC51b 1.5 3.0 DC51c 1.5 3.0 DC51e 4.1 7 DC51f 3.6 7 DC51g 3.5 7 DC50a 3 5 DC50b 3 5 DC50c 3 5 DC50e 7 9 DC50f 6 9 DC50g 6 9 DC43a ...

Page 153

... LVD, BOR, WDT, etc. are all switched off. 2: The current is the additional current consumed when the module is enabled. This current should be added to the base I current. PD © 2006 Microchip Technology Inc. dsPIC30F2010 Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40° -40°C T ...

Page 154

... TABLE 22-8: DC CHARACTERISTICS: I/O PIN INPUT SPECIFICATIONS DC CHARACTERISTICS Param Symbol Characteristic No Input Low Voltage DI10 I/O pins: with Schmitt Trigger buffer DI15 MCLR DI16 OSC1 (in XT, HS and LP modes) DI17 OSC1 (in RC mode) DI18 SDA, SCL DI19 SDA, SCL V Input High Voltage ...

Page 155

... TBD (2) V – 0.7 — — DD TBD — — V – 0.7 — — DD TBD — — — — 15 — — 50 — — 400 BO15 Power Up Time-out dsPIC30F2010 +85°C for Industrial A T +125°C for Extended A Units Conditions 8.5 mA 2.0 mA 1.6 mA 2.0 mA, V ...

Page 156

... TABLE 22-10: ELECTRICAL CHARACTERISTICS: BOR DC CHARACTERISTICS Param Symbol Characteristic No. (2) BO10 V BOR Voltage BOR V transition high to DD low BO15 V BHYS Note 1: Data in “Typ” column is at 5V, 25°C unless otherwise stated. Parameters are for design guidance only and are not tested. ...

Page 157

... Operating voltage V range as described in Section 22.1 “DC Charac- DD teristics”. Load Condition 2 - for OSC2 Pin 464 for all pins except OSC2 for OSC2 output OS20 OS30 OS30 OS25 OS40 dsPIC30F2010 +85°C for Industrial A +125°C for Extended OS31 OS31 OS41 DS70118G-page 155 ...

Page 158

... TABLE 22-13: EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No. OS10 F External CLKI Frequency OSC (External clocks allowed only in EC mode) Oscillator Frequency OS20 1/F OSC OSC OSC OS25 T Instruction Cycle Time CY (2) OS30 TosL, External Clock in (OSC1) TosH High or Low Time ...

Page 159

... Industrial +125°C for Extended Units Conditions MHz EC with 4x PLL MHz EC with 8x PLL MHz EC with 16x PLL MHz XT with 4x PLL MHz XT with 8x PLL MHz ...

Page 160

... TABLE 22-16: INTERNAL CLOCK TIMING EXAMPLES Clock F OSC Oscillator T CY (1) (MHz) Mode EC 0.200 Note 1: Assumption: Oscillator Postscaler is divide Instruction Execution Cycle Time Instruction Execution Frequency: MIPS = (F cycle). TABLE 22-17: AC CHARACTERISTICS: INTERNAL RC ACCURACY Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) ...

Page 161

... Measurements are taken in RC mode and EC mode where CLKO output These parameters are characterized but not tested in manufacturing. 4: Data in “Typ” column is at 5V, 25°C unless otherwise stated. © 2006 Microchip Technology Inc. dsPIC30F2010 DI35 DI40 New Value DO31 DO32 Standard Operating Conditions: 2.5V to 5.5V ...

Page 162

... FIGURE 22-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP TIMER TIMING CHARACTERISTICS V DD SY12 MCLR Internal POR SY11 PWRT Time-out SY30 OSC Time-out Internal Reset Watchdog Timer Reset I/O Pins SY35 FSCM Delay Note: Refer to Figure 22-2 for load conditions. ...

Page 163

... These parameters are characterized but not tested in manufacturing. 2: Data in “Typ” column is at 5V, 25°C unless otherwise stated. 3: Refer to Figure 22-1 and Table 22-10 for BOR. © 2006 Microchip Technology Inc. dsPIC30F2010 Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C T -40°C T ...

Page 164

... FIGURE 22-6: BAND GAP START-UP TIME CHARACTERISTICS 0V Enable Band Gap (see Note) Note: Band Gap is enabled when FBORPOR<7> is set. TABLE 22-21: BAND GAP START-UP TIME REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No. SY40 T Band Gap Start-up Time BGAP Note 1: These parameters are characterized but not tested in manufacturing. ...

Page 165

... SOSC1/T1CK oscillator input frequency range (oscillator enabled by setting bit TCS (T1CON, bit 1)) TA20 T Delay from External TxCK Clock CKEXTMRL Edge to Timer Increment © 2006 Microchip Technology Inc. dsPIC30F2010 Tx11 Tx10 Tx15 OS60 Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C -40° ...

Page 166

... TABLE 22-23: TIMER2 EXTERNAL CLOCK TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No. TtxH TB10 TxCK High Time TB11 TtxL TxCK Low Time TB15 TtxP TxCK Input Period Synchronous, TB20 T Delay from External TxCK Clock CKEXTMRL Edge to Timer Increment TABLE 22-24: TIMER3 EXTERNAL CLOCK TIMING REQUIREMENTS ...

Page 167

... TQ20 T Delay from External TxCK Clock CKEXTMRL Edge to Timer Increment Note 1: These parameters are characterized but not tested in manufacturing. © 2006 Microchip Technology Inc. dsPIC30F2010 TQ11 TQ10 TQ15 Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C T -40°C T ...

Page 168

... FIGURE 22-9: INPUT CAPTURE (CAPx) TIMING CHARACTERISTICS IC X Note: Refer to Figure 22-2 for load conditions. TABLE 22-26: INPUT CAPTURE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No. IC10 TccL ICx Input Low Time IC11 TccH ICx Input High Time IC15 TccP ICx Input Period Note 1: These parameters are characterized but not tested in manufacturing ...

Page 169

... Microchip Technology Inc. OC20 Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature (1) (2) Min Typ Max Units — — — — ns dsPIC30F2010 -40°C T +85°C for Industrial A -40°C T +125°C for Extended A Conditions — — DS70118G-page 167 ...

Page 170

... FIGURE 22-12: MOTOR CONTROL PWM MODULE FAULT TIMING CHARACTERISTICS FLTA/B MP20 PWMx FIGURE 22-13: MOTOR CONTROL PWM MODULE TIMING CHARACTERISTICS PWMx Note: Refer to Figure 22-2 for load conditions. TABLE 22-29: MOTOR CONTROL PWM MODULE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No ...

Page 171

... T -40°C (1) (2) Typ Max 6 T — — — — — — CY dsPIC30F2010 +85°C for Industrial A T +125°C for Extended A Units Conditions ns — ns — ns — ns — 16, 32, 64, 128 and 256 (Note 16, 32, 64, 128 and 256 (Note 2) DS70118G-page 169 ...

Page 172

... FIGURE 22-15: QEI MODULE INDEX PULSE TIMING CHARACTERISTICS QEA (input) QEB (input) Ungated Index TQ51 Index Internal Position TABLE 22-31: QEI INDEX PULSE TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No. TQ50 TqIL Filter Time to Recognize Low, with Digital Filter TQ51 TqiH ...

Page 173

... Data Input 20 — X Data Input 20 — X dsPIC30F2010 SP20 SP21 LSb LSb IN -40°C T +85°C for Industrial A -40°C T +125°C for Extended A Max Units Conditions — ns — — ns — — ...

Page 174

... FIGURE 22-17: SPI MODULE MASTER MODE (CKE =1) TIMING CHARACTERISTICS SP36 SCK X (CKP = 0) SP11 SCK X (CKP = 1) SDO MSb X SP40 SDI X MSb IN SP41 Note: Refer to Figure 22-2 for load conditions. TABLE 22-33: SPI MODULE MASTER MODE (CKE = 1) TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No ...

Page 175

... Data Input 20 — X Data Input 20 — SCK Input 120 — X Output 10 — (3) 1.5 T +40 — CY dsPIC30F2010 SP52 SP72 SP73 LSb SP51 LSb IN -40°C T +85°C for Industrial A -40°C T +125°C for Extended A Max Units Conditions — ns — — ns — ...

Page 176

... FIGURE 22-19: SPI MODULE SLAVE MODE (CKE = 1) TIMING CHARACTERISTICS SP60 SS X SP50 SCK X (CKP = 0) SP71 SCK X (CKP = 1) MSb SDO X SP30,SP31 SDI SDI X MSb IN SP41 SP40 Note: Refer to Figure 22-2 for load conditions. DS70118G-page 174 SP70 SP72 SP73 SP35 SP73 SP72 ...

Page 177

... Data Input 20 — X Data Input 20 — SCK input 120 — — (4) Edge 1 — — — dsPIC30F2010 -40°C T +85°C for Industrial A -40°C T +125°C for Extended A Max Units Conditions — ns — — ns — — — — ns See parameter D032 — ...

Page 178

... FIGURE 22-20: I C™ BUS START/STOP BITS TIMING CHARACTERISTICS (MASTER MODE) SCL IM31 IM30 SDA Start Condition Note: Refer to Figure 22-2 for load conditions. 2 FIGURE 22-21: I C™ BUS DATA TIMING CHARACTERISTICS (MASTER MODE) IM20 SCL IM11 IM10 SDA In IM40 ...

Page 179

... C™ Baud Rate Generator. Refer to Section 21 “Inter-Integrated Circuit™ C)” in the “dsPIC30F Family Reference Manual” (DS70046). 2: Maximum pin capacitance = 10 pF for all I © 2006 Microchip Technology Inc. dsPIC30F2010 Standard Operating Conditions: 2.5V to 5.5V (unless otherwise stated) Operating temperature -40°C T -40°C T (1) ...

Page 180

... FIGURE 22-22: I C™ BUS START/STOP BITS TIMING CHARACTERISTICS (SLAVE MODE) SCL IS31 IS30 SDA Start Condition 2 FIGURE 22-23: I C™ BUS DATA TIMING CHARACTERISTICS (SLAVE MODE) IS20 SCL IS30 IS31 SDA In IS40 SDA Out DS70118G-page 178 IS33 IS11 IS10 ...

Page 181

... MHz mode 0.5 — — 400 2 C™ pins (for 1 MHz mode only). dsPIC30F2010 +85°C for Industrial +125°C for Extended Units Conditions s Device must operate at a minimum of 1.5 MHz s Device must operate at a minimum of 10 MHz. ...

Page 182

... TABLE 22-38: 10-BIT HIGH-SPEED A/D MODULE SPECIFICATIONS AC CHARACTERISTICS Param Symbol Characteristic No. AD01 AV Module V Supply DD DD AD02 AV Module V Supply SS SS AD05 V Reference Voltage High REFH AD06 V Reference Voltage Low REFL AD07 V Absolute Reference Voltage REF AD08 I Current Drain REF AD10 V -V Full-Scale Input Span ...

Page 183

... The A/D conversion result never decreases with an increase in the input voltage, and has no missing codes. 3: Measurements were taken with external V © 2006 Microchip Technology Inc. dsPIC30F2010 Standard Operating Conditions: 2.7V to 5.5V (unless otherwise stated) Operating temperature -40°C T -40°C T Min. ...

Page 184

... FIGURE 22-24: 10-BIT HIGH-SPEED A/D CONVERSION TIMING CHARACTERISTICS (CHPS = 01, SIMSAM = 0, ASAM = 0, SSRC = 000) AD50 ADCLK Instruction Execution SET SAMP CLEAR SAMP SAMP ch0_dischrg ch0_samp ch1_dischrg ch1_samp eoc AD61 AD60 T SAMP DONE ADIF ADRES(0) ADRES( – Software sets ADCON. SAMP to start sampling. ...

Page 185

... Software sets ADCON. ADON to start AD operation. 2 – Sampling starts after discharge period described in the “dsPIC30F SAMP Family Reference Manual” (DS70046), Section 17. 3 – Convert bit 9. 4 – Convert bit 8. © 2006 Microchip Technology Inc. dsPIC30F2010 AD55 AD55 – Convert bit 0. ...

Page 186

... TABLE 22-39: 10-BIT HIGH-SPEED A/D CONVERSION TIMING REQUIREMENTS AC CHARACTERISTICS Param Symbol Characteristic No. AD50 T A/D Clock Period AD AD51 t A/D Internal RC Oscillator Period RC AD55 t Conversion Time CONV AD56 F Throughput Rate CNV AD57 T Sample Time SAMP AD60 t Conversion Start from Sample PCS Trigger ...

Page 187

... In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2006 Microchip Technology Inc. dsPIC30F2010 Example dsPIC30F2010 -30I/ 060700U Example dsPIC30F2010-30I/SP 0648017 e 3 Example dsPIC30F2010-30I/SO 0648017 DS70118G-page 185 ...

Page 188

... Plastic Quad Flat, No Lead Package (MM) - 6x6x0.9 mm Body [QFN-S] With 0.40 mm Contact Length Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D TOP VIEW A3 Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Width ...

Page 189

... L .125 .130 .135 c .008 .012 .015 B1 .040 .053 .065 B .016 .019 .022 eB .320 .350 .430 dsPIC30F2010 MILLIMETERS MIN NOM MAX 28 2.54 3.56 3.81 4.06 3.18 3.30 3.43 0.38 7.62 7.87 8.26 6.99 7.24 7.49 34.16 34.67 35.18 3.18 3.30 3 ...

Page 190

... Plastic Small Outline (SO) – Wide, 300 mil Body (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width ...

Page 191

... Table 22-15 ) • Internal RC Accuracy specifications (see Table 22-17) • Watchdog Timer time-out limits (see Table 22-20) • Additional minor corrections throughout document. Revision G (December 2006) This revision includes updates to the packaging diagrams. © 2006 Microchip Technology Inc. dsPIC30F2010 DS70118G-page 189 ...

Page 192

... NOTES: DS70118G-page 190 © 2006 Microchip Technology Inc. ...

Page 193

... Modifier Values (Table)............................................... 36 Sequence Table (16-Entry)......................................... 36 Block Diagram PWM ........................................................................... 82 Block Diagrams 10-bit High Speed ADC Functional ........................... 111 16-bit Timer1 Module .................................................. 58 DSP Engine ................................................................ 14 dsPIC30F2010 .............................................................. 6 External Power-on Reset Circuit............................... 131 2 I C............................................................................... 96 Input Capture Mode .................................................... 67 Oscillator System ...................................................... 125 Output Compare Mode ............................................... 71 Quadrature Encoder Interface .................................... 75 Reset System ...

Page 194

... Dead-Time Generators ....................................................... 86 Ranges........................................................................ 86 Development Support ....................................................... 145 Device Configuration Register Map............................................................. 135 Device Configuration Registers......................................... 134 FBORPOR ................................................................ 134 FGS........................................................................... 134 FOSC ........................................................................ 134 FWDT........................................................................ 134 Device Overview ................................................................... 5 Divide Support..................................................................... 12 DSP Engine......................................................................... 13 Multiplier...................................................................... 15 Dual Output Compare Match Mode .................................... 72 Continuous Pulse Mode .............................................. 72 Single Pulse Mode ...................................................... 72 E Edge-Aligned PWM ...

Page 195

... MPLAB PM3 Device Programmer .................................... 147 MPLINK Object Linker/MPLIB Object Librarian ................ 146 O OC/PWM Module Timing Characteristics.......................... 169 Operating Current (I )..................................................... 151 DD Operating MIPS vs Voltage dsPIC30F2010 .......................................................... 149 Oscillator Configurations Fast RC (FRC) .................................................. 127 Low Power RC (LPRC) ..................................... 127 Phase Locked Loop (PLL) ................................ 127 Oscillator Configurations ................................................... 126 Fail-Safe Clock Monitor............................................. 128 Initial Clock Source Selection ...

Page 196

... PWM Register Map............................................................... 90 PWM Duty Cycle Comparison Units ................................... 85 Duty Cycle Register Buffers ........................................ 86 PWM FLTA Pins.................................................................. 88 Enable Bits .................................................................. 88 Fault States ................................................................. 88 Modes ......................................................................... 88 Cycle-by-Cycle.................................................... 88 Latched ............................................................... 88 PWM Operation During CPU Idle Mode.............................. 89 PWM Operation During CPU Sleep Mode .......................... 89 PWM Output and Polarity Control ....................................... 88 Output Pin Control ...................................................... 88 PWM Output Override ...

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... Tied ...................................................... 130 DD Timing Diagrams and Specifications DC Characteristics - Internal RC Accuracy............... 160 Timing Diagrams.See Timing Characteristics © 2006 Microchip Technology Inc. dsPIC30F2010 Timing Requirements A/D Conversion High-speed ....................................................... 186 Band Gap Start-up Time........................................... 164 Brown-out Reset....................................................... 163 CLKO and I/O ........................................................... 161 External Clock .......................................................... 158 ...

Page 198

... W Wake-up from Sleep ......................................................... 123 Wake-up from Sleep and Idle.............................................. 41 Watchdog Timer Timing Characteristics .............................................. 162 Timing Requirements ................................................ 163 Watchdog Timer (WDT) ............................................ 123, 133 Enabling and Disabling ............................................. 133 Operation .................................................................. 133 WWW Address.................................................................. 199 WWW, On-Line Support........................................................ 4 DS70118G-page 196 © 2006 Microchip Technology Inc. ...

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... Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com dsPIC30F2010 should contact their distributor, DS70118G-page 197 ...

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... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: dsPIC30F2010 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

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