PIC18F8390-E/PT Microchip Technology, PIC18F8390-E/PT Datasheet - Page 11
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PIC18F8390-E/PT
Manufacturer Part Number
PIC18F8390-E/PT
Description
IC PIC MCU FLASH 8KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F6310-IPT.pdf
(28 pages)
3.PIC18F6390-IPT.pdf
(414 pages)
4.PIC18F6390-IPT.pdf
(16 pages)
5.PIC18F6390-IPT.pdf
(12 pages)
6.PIC18F6390-IPT.pdf
(6 pages)
7.PIC18F6390-IPT.pdf
(4 pages)
Specifications of PIC18F8390-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, LCD, POR, PWM, WDT
Number Of I /o
66
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI, I2C, EUSART, AUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
66
Number Of Timers
1 x 8
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163028
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPDM163028 - BOARD DEMO PICDEM LCDAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F8390-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
3.0
3.1
The term “Blank Check” means to verify that the device
has no programmed memory cells. All memories must
be
configuration
(3FFFFEh:3FFFFFh) should be ignored. The blank
checking step involves reading the code memory
space and comparing it against FFFFh. Memory reads
occur a single byte at a time, so two bytes must be read
to compare against FFFFh. Refer to Section 4.1
“Read
Configuration Bits”.
FIGURE 3-1:
© 2007 Microchip Technology Inc.
verified:
Note 1: The erased state of configuration bits are given in Table 5-2.
DEVICE PROGRAMMING
Blank Check
Code
No
code
bits.
Pointer to 000000h
Memory,
Read High Byte
Word = FFFFh?
Read Low Byte
Code Memory
Load Address
Verified?
BLANK CHECK FLOW
memory,
The
Does
Start
All
Yes
Yes
Device
ID
ID
Locations
PIC18F8410/8490/8493 FAMILY
No
locations
ID
Device not
Report,
registers
Blank
and
and
A “Blank” or “Erased” memory cell will read as a ‘1’. So,
“Blank Checking” a device merely means to verify that
all bytes read as FFh, except the configuration bits.
Unused (reserved) configuration bits will read as ‘0’.
Refer to Table 5-3 for blank configuration except data
for the various PIC18F8410/8490/8493 family devices.
If it is determined that the device is not blank, then the
device
“High-Voltage ICSP Chip Erase”) before any attempt
to program is made.
No
No
should
Pointer to 200000h
Pointer to 300000h
Configuration bits
Word = FFFFh?
Read High Byte
Read High Byte
Read Low Byte
Read Low Byte
Word = Erased
Load Address
Load Address
ID Locations
Verified?
Verified?
State
Does
Does
All
All
Yes
Yes
Yes
Yes
be
(1)
?
Erased
No
No
Device is
Report
Blank
Device not
Device not
(see
DS39624C-page 11
Report,
Report,
Blank
Blank
Section 3.2