DSPIC30F3012T-20E/ML Microchip Technology, DSPIC30F3012T-20E/ML Datasheet - Page 10

• Manufacturer Part Number: DSPIC30F3012T-20E/ML
• Description: IC DSPIC MCU/DSP 24K 44QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F3012T-20E/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 12
• Program Memory Size: 24KB (8K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 8x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 44-QFN
• For Use With: XLT44QFN5 - SOCKET TRANS ICE 18DIP TO 44QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

dsPIC30F3012/3013
11. Module: Sleep Mode
EXAMPLE 9:
DS80448D-page 10
; ----------------------------------------------------------------------------------------------
.global __reset
.global _main
.global _GotoSleep
.global __AddressError
.global __INT1Interrupt
; ----------------------------------------------------------------------------------------------
_main:
_continue:
; ----------------------------------------------------------------------------------------------
; Address Error Trap
__AddressError:
; ----------------------------------------------------------------------------------------------
__INT1Interrupt:
; ----------------------------------------------------------------------------------------------
_GotoSleep:
; fill remainder of the last row with NOP instructions
; Place SLEEP instruction in the last word of program memory
Execution of the Sleep instruction (PWRSAV #0)
may cause incorrect program operation after the
device wakes up from Sleep. The current
consumption during Sleep may also increase
beyond the specifications listed in the device data
sheet.
Work arounds
To avoid this issue, implement any of the following
three work arounds, depending on the application
requirements.
Work around 1:
Ensure that the PWRSAV #0 instruction is located
at the end of the last row of program Flash memory
available on the target device and fill the
remainder of the row with NOP instructions.
.section *, code
BSET
BCLR
BSET
CALL
BRA
BCLR
; Set program memory return address to _continue
POP.D
MOV.B
MOV
PUSH.D W0
RETFIE
BCLR
RETFIE
.section *, code, address (0x1FC0)
.rept 31
.endr
PWRSAV #0
NOP
_continue
W0
#tblpage (_continue), W1
#tbloffset (_continue), W0
IFS1, #INT1IF
INTCON2, #INT1EP
IFS1, #INT1IF
IEC1, #INT1IE
_GotoSleep
INTCON1, #ADDRERR
; Set up INT pins to detect falling edge
; Clear interrupt pin interrupt flag bits
; Enable ISR processing for INT pins
; Call function to enter SLEEP mode
; Ensure flag is reset
; Return from Interrupt Service Routine
This can be accomplished by replacing all
occurrences of the PWRSAV #0 instruction with a
function call to a suitably aligned subroutine. The
address( ) attribute provided by the MPLAB
ASM30 assembler can be utilized to correctly align
the instructions in the subroutine. For an
application written in C, the function call would be
GotoSleep( ), while for an assembly language
application,
CALL _GotoSleep.
The address error Trap Service Routine (TSR)
software can then replace the invalid return
address saved on the stack with the address of the
instruction immediately following the _GotoSleep
or GotoSleep( ) function call. This ensures that
the device continues executing the correct code
sequence after waking up from Sleep mode.
Example 9
described above.
demonstrates
the
© 2010 Microchip Technology Inc.
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