PIC18LF26J50-I/ML Microchip Technology, PIC18LF26J50-I/ML Datasheet - Page 9

• Manufacturer Part Number: PIC18LF26J50-I/ML
• Description: IC PIC MCU FLASH 64K 2V 28-QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18LF26J50-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 64KB (32K x 16)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 48MHz
• Connectivity: I²C, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 16
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC18LF
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 4 KB
• Interface Type: EUSART, I2C, SPI
• Maximum Clock Frequency: 31 KHz
• Number Of Programmable I/os: 16
• Number Of Timers: 5
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DV164136, MA180024, DM183022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel
• A/d Bit Size: 10 bit
• A/d Channels Available: 10
• Height: 0.88 mm
• Length: 6 mm
• Supply Voltage (max): 2.75 V, 3.6 V
• Supply Voltage (min): 2 V
• Width: 6 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX A:
Rev A Document (2/2009)
First release of this document. Silicon issues
1 (T1DIG),
6 (PMP), 7 (Deep Sleep), 8 (Supply Voltage).
Rev B Document (5/2009)
Added silicon issues 9 (Band Gap Reference) and
10 (Charge Time Measurement Unit – CTMU).
Rev C Document (1/2010)
Converted existing document for the A2 silicon revision
to the new, combined format. (There were no other
silicon errata or data sheet clarification documents for
the device family.)
Removed silicon issue 1 (Special Features, T1DIG)
and
2 (MSSP1) and 6 (Low-Power Modes – Deep Sleep).
Added data sheet clarifications 1 (Special Features –
CONFIG2L), 2 (DC Characteristics – Power-Down
Current) and 3 (DC Characteristics – Input Leakage).
 2010 Microchip Technology Inc.
modified
2-3 (MSSP),
decremented
DOCUMENT
REVISION HISTORY
4 (EUSART),
issue
1,
5 (ADC),
formerly
PIC18F46J50 FAMILY
DS80436C-page 9