PIC18LF4455T-I/ML Microchip Technology, PIC18LF4455T-I/ML Datasheet - Page 191
![IC PIC MCU FLASH 12KX16 44QFN](/photos/6/81/68122/150-44-qfn_sml.jpg)
PIC18LF4455T-I/ML
Manufacturer Part Number
PIC18LF4455T-I/ML
Description
IC PIC MCU FLASH 12KX16 44QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PCM18XR1.pdf
(438 pages)
3.PIC18F2221-ISO.pdf
(46 pages)
4.PIC18F2455-ISO.pdf
(14 pages)
5.PIC18F2455-ISO.pdf
(8 pages)
6.PIC18F2455-ISO.pdf
(26 pages)
Specifications of PIC18LF4455T-I/ML
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
24KB (12K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 13x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-QFN
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SPI, I2C, EAUSART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
35
Number Of Timers
4
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163025
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PCM18XR1 PDF datasheet #2
- PIC18F2221-ISO PDF datasheet #3
- PIC18F2455-ISO PDF datasheet #4
- PIC18F2455-ISO PDF datasheet #5
- PIC18F2455-ISO PDF datasheet #6
- Current page: 191 of 438
- Download datasheet (7Mb)
17.10 Overview of USB
This section presents some of the basic USB concepts
and useful information necessary to design a USB
device. Although much information is provided in this
section, there is a plethora of information provided
within the USB specifications and class specifications.
Thus, the reader is encouraged to refer to the USB
specifications for more information (www.usb.org). If
you are very familiar with the details of USB, then this
section serves as a basic, high-level refresher of USB.
17.10.1
USB device functionality is structured into a layered
framework graphically shown in Figure 17-13. Each
level is associated with a functional level within the
device. The highest layer, other than the device, is the
configuration. A device may have multiple configura-
tions. For example, a particular device may have
multiple power requirements based on Self-Power Only
or Bus Power Only modes.
For each configuration, there may be multiple
interfaces. Each interface could support a particular
mode of that configuration.
Below the interface is the endpoint(s). Data is directly
moved at this level. There can be as many as
16 bidirectional endpoints. Endpoint 0 is always a
control endpoint and by default, when the device is on
the bus, Endpoint 0 must be available to configure the
device.
17.10.2
Information communicated on the bus is grouped into
1 ms time slots, referred to as frames. Each frame can
contain many transactions to various devices and
endpoints. Figure 17-9 shows an example of a
transaction within a frame.
FIGURE 17-13:
© 2009 Microchip Technology Inc.
LAYERED FRAMEWORK
FRAMES
Endpoint
USB LAYERS
Interface
Endpoint
Endpoint
PIC18F2455/2550/4455/4550
Configuration
Device
17.10.3
There are four transfer types defined in the USB
specification.
• Isochronous: This type provides a transfer
• Bulk: This type of transfer method allows for large
• Interrupt: This type of transfer provides for
• Control: This type provides for device setup
While full-speed devices support all transfer types,
low-speed devices are limited to interrupt and control
transfers only.
17.10.4
Power is available from the Universal Serial Bus. The
USB specification defines the bus power requirements.
Devices may either be self-powered or bus powered.
Self-powered devices draw power from an external
source, while bus powered devices use power supplied
from the bus.
Endpoint
method for large amounts of data (up to
1023 bytes) with timely delivery ensured;
however, the data integrity is not ensured. This is
good for streaming applications where small data
loss is not critical, such as audio.
amounts of data to be transferred with ensured
data integrity; however, the delivery timeliness is
not ensured.
ensured timely delivery for small blocks of data,
plus data integrity is ensured.
control.
To other Configurations (if any)
Interface
TRANSFERS
POWER
Endpoint
To other Interfaces (if any)
DS39632E-page 189
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